Datasheet > ADL5544

ADL5544

更新时间： 2022-06-02 13:58:33

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
20页	418K
描述
30 MHz to 6 GHz RF/IF Gain Block

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ADL5544 数据手册

Data Sheet

ADL5544

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 3.

Table 4 lists the junction-to-air thermal resistance (θ_JA) and the

junction-to-case thermal resistance (θ_JC) for the ADL5544.

Parameter

Rating

6.5 V

18 dBm

400 mW

Supply Voltage, V_POS

Input Power (50 Ω Impedance)

Internal Power Dissipation

(Pad Soldered to Ground)

Table 4. Thermal Resistance

Package Type

θ_JA

θ_JC

Unit

3-Lead SOT-89 (RK-3)

°C/W

Maximum Junction Temperature

Operating Temperature Range

Storage Temperature Range

150°C

−40°C to +105°C

−65°C to +150°C

¹Measured on the ADL5544 evaluation board. For more information about

board layout, see the Soldering Information and Recommended PCB Land

Pattern section.

²Based on simulation with a standard JEDEC board per JESD51.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

Rev. 0 | Page 7 of 20

1...4 5 678 9 10...20

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