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ADG3233BRM-REEL7 PDF预览

ADG3233BRM-REEL7

更新时间: 2024-02-18 18:12:34
品牌 Logo 应用领域
亚德诺 - ADI 驱动程序和接口开关接口集成电路
页数 文件大小 规格书
12页 264K
描述
Low Voltage 1.65 V to 3.6 V, Bidirectional Logic Level Translation, Bypass Switch

ADG3233BRM-REEL7 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:TSSOP
包装说明:TSSOP,针数:8
Reach Compliance Code:unknown风险等级:5.27
接口集成电路类型:INTERFACE CIRCUITJESD-30 代码:S-PDSO-G8
JESD-609代码:e0长度:3 mm
湿度敏感等级:1功能数量:1
端子数量:8最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装形状:SQUARE
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):240
认证状态:COMMERCIAL座面最大高度:1.1 mm
最大供电电压:3.6 V最小供电电压:1.65 V
标称供电电压:1.8 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:TIN LEAD
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
宽度:3 mm

ADG3233BRM-REEL7 数据手册

 浏览型号ADG3233BRM-REEL7的Datasheet PDF文件第1页浏览型号ADG3233BRM-REEL7的Datasheet PDF文件第2页浏览型号ADG3233BRM-REEL7的Datasheet PDF文件第3页浏览型号ADG3233BRM-REEL7的Datasheet PDF文件第5页浏览型号ADG3233BRM-REEL7的Datasheet PDF文件第6页浏览型号ADG3233BRM-REEL7的Datasheet PDF文件第7页 
ADG3233  
ABSOLUTE MAXIMUM RATINGS*  
(TA = 25°C, unless otherwise noted.)  
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300°C  
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235°C  
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +4.6 V  
Digital Inputs to GND . . . . . . . . . . . . . . . . . . –0.3 V to +4.6 V  
A1, EN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +4.6 V  
A2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VCC1 + 0.3V  
DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA  
Operating Temperature Range  
*Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. This is a stress rating only; functional operation of the  
device at these or any other conditions above those listed in the operational sections  
of this specification is not implied. Exposure to absolute maximum rating condi-  
tionsforextendedperiodsmayaffectdevicereliability. Onlyoneabsolutemaximum  
rating may be applied at any one time.  
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C  
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C  
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C  
8-Lead MSOP  
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W  
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 43°C/W  
8-Lead SOT-23  
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 211°C/W  
ORDERING GUIDE  
Model  
Temperature Range  
Package Description  
Branding  
Package Option  
ADG3233BRJ-REEL  
ADG3233BRJ-REEL7  
ADG3233BRM  
ADG3233BRM-REEL  
ADG3233BRM-REEL7 –40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
SOT-23  
SOT-23  
MSOP  
MSOP  
MSOP  
W1B  
W1B  
W1B  
W1B  
W1B  
RJ-8  
RJ-8  
RM-8  
RM-8  
RM-8  
PIN CONFIGURATIONS  
8-Lead SOT-23 Package (RJ-8)  
8-Lead MSOP Package (RM-8)  
V
1
2
3
4
8
7
6
5
V
V
1
2
3
4
8
7
6
5
V
CC1  
CC1  
A1  
CC2  
CC2  
Y1  
Y1  
A1  
A2  
EN  
ADG3233  
ADG3233  
A2  
Y2  
Y2  
TOP VIEW  
TOP VIEW  
(Not to Scale)  
(Not to Scale)  
EN  
GND  
GND  
PIN FUNCTION DESCRIPTIONS  
Pin  
RJ-8 RM-8 Mnemonic Description  
1
8
2
3
7
6
8
1
7
6
2
3
VCC1  
VCC2  
A1  
A2  
Y1  
Supply Voltage 1, can be any supply voltage from 1.65 V to 3.6 V.  
Supply Voltage 2, can be any supply voltage from 1.65 V to 3.6 V.  
Input Referred to VCC1  
Input Referred to VCC2  
.
.
Output Referred to VCC1.  
Y2  
Output Referred to VCC2. Voltage levels appearing at Y2 will be translated from VCC1 voltage level to a  
VCC2 voltage level.  
4
5
5
4
EN  
GND  
Active Low Device Enable. When low, bypass mode is enabled; when high, the device is in normal mode.  
Device Ground.  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although the  
ADG3233 features proprietary ESD protection circuitry, permanent damage may occur on devices  
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended  
to avoid performance degradation or loss of functionality.  
–4–  
REV. 0  

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