ADF4110/ADF4111/ADF4112/ADF4113
Data Sheet
ORDERING GUIDE
Model1
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
-40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
Package Option2
ADF4110BCPZ
20-Lead Frame Chip Scale Package [LFCSP_WQ]
20-Lead Frame Chip Scale Package [LFCSP_WQ]
20-Lead Frame Chip Scale Package [LFCSP_WQ]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Frame Chip Scale Package [LFCSP_WQ]
20-Lead Frame Chip Scale Package [LFCSP_WQ]
20-Lead Frame Chip Scale Package [LFCSP_WQ]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Frame Chip Scale Package [LFCSP_WQ]
20-Lead Frame Chip Scale Package [LFCSP_WQ]
20-Lead Frame Chip Scale Package [LFCSP_WQ]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Frame Chip Scale Package [LFCSP_WQ]
20-Lead Frame Chip Scale Package [LFCSP_WQ]
20-Lead Frame Chip Scale Package [LFCSP_WQ]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
DIE
CP-20-6
CP-20-6
CP-20-6
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
ADF4110BCPZ-RL
ADF4110BCPZ-RL7
ADF4110BRU
ADF4110BRU-REEL
ADF4110BRU-REEL7
ADF4110BRUZ
ADF4110BRUZ-RL
ADF4110BRUZ-RL7
ADF4111BCPZ
ADF4111BCPZ-RL
ADF4111BCPZ-RL7
ADF4111BRU
CP-20-6
CP-20-6
CP-20-6
RU-16
RU-16
RU-16
ADF4111BRUZ
ADF4111BRUZ-RL
ADF4111BRUZ-RL7
ADF4112BCPZ
ADF4112BCPZ-RL
ADF4112BCPZ-RL7
ADF4112BRU
ADF4112BRU-REEL7
ADF4112BRUZ
ADF4112BRUZ-REEL
ADF4112BRUZ-REEL7
ADF4113BCPZ
ADF4113BCPZ-RL
ADF4113BCPZ-RL7
ADF4113BRU
ADF4113BRU-REEL7
ADF4113BRUZ
ADF4113BRUZ-REEL
ADF4113BRUZ-REEL7
ADF4113BCHIPS
EVAL-ADF4113EBZ1
EVAL-ADF4113EBZ2
EV-ADF411XSD1Z
RU-16
CP-20-6
CP-20-6
CP-20-6
RU-16
RU-16
RU-16
RU-16
RU-16
CP-20-6
CP-20-6
CP-20-6
RU-16
RU-16
RU-16
RU-16
RU-16
Evaluation Board
Evaluation Board
Evaluation Board
1 Z = RoHS Compliant Part.
2 CP-20-6 package was formerly CP-20-1 package.
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent
Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03496-0-1/13(F)
Rev. F | Page 28 of 28