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ADA4939-2YCPZ-R2 PDF预览

ADA4939-2YCPZ-R2

更新时间： 2024-01-30 07:14:11
品牌 Logo 应用领域
亚德诺 - ADI 驱动器
页数 文件大小 规格书
24页 518K
描述
Ultralow Distortion Differential ADC Driver

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ADA4939-2YCPZ-R2 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：QFN
包装说明：HVQCCN,针数：24
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.4
差分输出：YES驱动器位数：1
输入特性：DIFFERENTIAL接口集成电路类型：LINE DRIVER
接口标准：GENERAL PURPOSEJESD-30 代码：S-XQCC-N24
JESD-609代码：e3长度：4 mm
湿度敏感等级：3功能数量：2
端子数量：24最高工作温度：105 °C
最低工作温度：-40 °C封装主体材料：UNSPECIFIED
封装代码：HVQCCN封装形状：SQUARE
封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度（摄氏度）：260
认证状态：Not Qualified最大接收延迟：
座面最大高度：1 mm最大供电电压：5.25 V
最小供电电压：3 V标称供电电压：5 V
表面贴装：YES技术：BIPOLAR
温度等级：INDUSTRIAL端子面层：Matte Tin (Sn)
端子形式：NO LEAD端子节距：0.5 mm
端子位置：QUAD处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：4 mmBase Number Matches：1

ADA4939-2YCPZ-R2 数据手册

 浏览型号ADA4939-2YCPZ-R2的Datasheet PDF文件第4页浏览型号ADA4939-2YCPZ-R2的Datasheet PDF文件第5页浏览型号ADA4939-2YCPZ-R2的Datasheet PDF文件第6页浏览型号ADA4939-2YCPZ-R2的Datasheet PDF文件第8页浏览型号ADA4939-2YCPZ-R2的Datasheet PDF文件第9页浏览型号ADA4939-2YCPZ-R2的Datasheet PDF文件第10页 
ADA4939-1/ADA4939-2  
ABSOLUTE MAXIMUM RATINGS  
The power dissipated in the package (PD) is the sum of the  
quiescent power dissipation and the power dissipated in the  
package due to the load drive. The quiescent power is the voltage  
between the supply pins (VS) times the quiescent current (IS).  
The power dissipated due to the load drive depends upon the  
particular application. The power due to load drive is calculated  
by multiplying the load current by the associated voltage drop  
across the device. RMS voltages and currents must be used in  
these calculations.  
Table 7.  
Parameter  
Rating  
Supply Voltage  
5.5 V  
Power Dissipation  
Input Current, +IN, −IN,  
See Figure 4  
5 mA  
PD  
Storage Temperature Range  
Operating Temperature Range  
ADA4939-1  
ADA4939-2  
Lead Temperature (Soldering, 10 sec)  
Junction Temperature  
−65°C to +125°C  
−40°C to +105°C  
−40°C to +105°C  
300°C  
Airflow increases heat dissipation, effectively reducing θJA. In  
addition, more metal directly in contact with the package leads/  
exposed pad from metal traces, through holes, ground, and power  
planes reduces θJA.  
150°C  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational section of  
this specification is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device  
reliability.  
Figure 4 shows the maximum safe power dissipation in the  
package vs. the ambient temperature for the single 16-lead  
LFCSP (98°C/W) and the dual 24-lead LFCSP (67°C/W) on a  
JEDEC standard four-layer board with the exposed pad  
soldered to a PCB pad that is connected to a solid plane.  
3.0  
THERMAL RESISTANCE  
2.5  
θJA is specified for the device (including exposed pad) soldered  
to a high thermal conductivity 2s2p circuit board, as described  
in EIA/JESD 51-7.  
ADA4939-2  
2.0  
1.5  
Table 8. Thermal Resistance  
ADA4939-1  
Package Type  
θJA  
98  
67  
Unit  
°C/W  
°C/W  
1.0  
0.5  
0
ADA4939-1, 16-Lead LFCSP (Exposed Pad)  
ADA4939-2, 24-Lead LFCSP (Exposed Pad)  
MAXIMUM POWER DISSIPATION  
–40  
–20  
0
20  
40  
60  
80  
100  
The maximum safe power dissipation in the ADA4939 package  
is limited by the associated rise in junction temperature (TJ) on  
the die. At approximately 150°C, which is the glass transition  
temperature, the plastic changes its properties. Even temporarily  
exceeding this temperature limit can change the stresses that the  
package exerts on the die, permanently shifting the parametric  
performance of the ADA4939. Exceeding a junction temperature  
of 150°C for an extended period can result in changes in the  
silicon devices, potentially causing failure.  
AMBIENT TEMPERATURE (°C)  
Figure 4. Maximum Power Dissipation vs. Ambient Temperature for  
a Four-Layer Board  
ESD CAUTION  
Rev. 0 | Page 7 of 24  
 
 
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