Data Sheet
ADA4558
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
15 ISINK
14 TNEG
13 TPOS
1
2
3
4
5
DVDD
DGND
TESTD
SWDIO
SWCLK
ADA4558
TOP VIEW
(Not to Scale)
12
RREFN
11 VREG
NOTES
1. NIC = NOT INTERNALLY CONNECTED. THIS PIN IS NOT INTERNALLY CONNECTED.
CONNECT NIC TO THE GROUND PLANE.
2. CONNECT THE EXPOSED PAD OF THE LFCSP PACKAGE TO THE ANALOG GROUND PLANE.
ENSURE THAT AGND IS CONNECTED TO DGND AND LINGND AT A SINGLE POINT ON THE PCB.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1
DVDD
1.8 V Low Dropout (LDO) Digital Supply. Add a 0.1 μF capacitor placed as close to Pin 1 as possible between DVDD
and the DGND plane.
2
3
4
5
6
7
8
9
DGND
TESTD
SWDIO
SWCLK
NIC
VNEG
TEST1
VPOS
TEST2
VREG
Digital Ground.
Test Pin. Analog Devices, Inc., uses this pin at the production test. Connect TESTD to the DGND plane in the application.
Test Pin. Analog Devices uses this pin at the production test. Connect SWDIO to the DGND plane in the application.
Test Pin. Analog Devices uses this pin at the production test. Connect SWCLK to the DGND plane in the application.
Not Internally Connected. This pin is not internally connected. Connect NIC to the ground plane.
Negative Input. Pin 7 is the negative input to the PGA from the external resistive bridge.
Test Pin. Analog Devices uses this pin at the production test. Connect TEST1 to the AGND plane in the application.
Positive Input. Pin 9 is the positive input to the PGA from an external resistive bridge.
10
11
Test Pin. Analog Devices uses this pin at the production test. Connect TEST2 to the AGND plane in the application.
Regulated 4.0 V Output. Pin 11 drives the top of the external bridge. Add a 0.1 μF capacitor between VREG and the
AGND plane, placed as close to the VREG pin as possible.
12
RREFN
Reference Resistor. Pin 12 is the reference resistor for the external temperature sensor sense connection. Connect
Pin 12 to ground when there is no external temperature sensor.
13
14
15
TPOS
TNEG
ISINK
External Temperature Positive Input. Connect Pin 13 to ground when there is no external temperature sensor.
External Temperature Sensor Negative Input. Connect Pin 14 to ground when there is no external temperature sensor.
Current Sink. Pin 15 drives the external temperature sensor. Connect Pin 15 to ground when there is no external
temperature sensor.
16
17
AGND
VDD12
Analog Ground.
Supply. Connect the 12 V battery supply to this pin. Decouple VDD12 with a 1 µF capacitor. A 100 nF capacitor can
be used only when a 1 µF capacitor to ground is placed on the anode of the diode on the module battery supply.
18
19
LIN2
LIN
Not in Use. The LIN2 function is not in use. Connect LIN2 to the LIN pin.
LIN Compliant Interface. All communication to and from the IC is via the LIN pin. Connect a LIN capacitor to ground
on this pin, per the LIN specification.
20
LINGND
EPAD
Local LIN Ground.
Exposed Pad. Connect the exposed pad of the LFCSP to the analog ground plane. Ensure that AGND is connected
to DGND and LINGND at a single point on the PCB.
Rev. 0 | Page 7 of 12
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