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ADA4420-6ARUZ PDF预览

ADA4420-6ARUZ

更新时间： 2024-02-08 00:35:02
品牌 Logo 应用领域
亚德诺 - ADI 光电二极管商用集成电路
页数 文件大小 规格书
16页 247K
描述
Low Cost 6-Channel HD/SD Video Filter

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ADA4420-6ARUZ 技术参数

Source Url Status Check Date：2013-05-01 14:56:33.509是否无铅： 含铅
是否Rohs认证： 符合生命周期：Active
零件包装代码：TSSOP包装说明：TSSOP,
针数：20Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8542.39.00.01
风险等级：5.08商用集成电路类型：CONSUMER CIRCUIT
JESD-30 代码：R-PDSO-G20JESD-609代码：e3
长度：6.5 mm湿度敏感等级：1
功能数量：1端子数量：20
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：TSSOP
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）：260认证状态：Not Qualified
座面最大高度：1.2 mm最大供电电压 (Vsup)：5.25 V
最小供电电压 (Vsup)：4.75 V表面贴装：YES
温度等级：INDUSTRIAL端子面层：MATTE TIN
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL处于峰值回流温度下的最长时间：30
宽度：4.4 mmBase Number Matches：1

ADA4420-6ARUZ 数据手册

 浏览型号ADA4420-6ARUZ的Datasheet PDF文件第1页浏览型号ADA4420-6ARUZ的Datasheet PDF文件第2页浏览型号ADA4420-6ARUZ的Datasheet PDF文件第3页浏览型号ADA4420-6ARUZ的Datasheet PDF文件第5页浏览型号ADA4420-6ARUZ的Datasheet PDF文件第6页浏览型号ADA4420-6ARUZ的Datasheet PDF文件第7页 
ADA4420-6  
ABSOLUTE MAXIMUM RATINGS  
The power dissipated in the package (PD) is the sum of the  
quiescent power dissipation and the power dissipated in the  
package due to the load drive for all outputs. The quiescent  
power is the voltage between the supply pins (VS) times the  
quiescent current (IS). The power dissipated due to load drive  
depends on the particular application. For each output, the  
power due to load drive is calculated by multiplying the load  
current by the associated voltage drop across the device. The  
power dissipated due to the loads is equal to the sum of the  
power dissipations due to each individual load. RMS voltages  
and currents must be used in these calculations.  
Table 2.  
Parameter  
Rating  
Supply Voltage  
Power Dissipation  
Storage Temperature Range  
Operating Temperature Range  
Lead Temperature (Soldering, 10 sec)  
Junction Temperature  
5.5 V  
See Figure 2  
−65°C to +125°C  
−40°C to +85°C  
300°C  
150°C  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Airflow increases heat dissipation, effectively reducing θJA.  
Figure 2 shows the maximum power dissipation in the package  
vs. the ambient temperature for the 16-lead QSOP (105°C/W)  
and the 20-lead TSSOP (143°C/W) on a JEDEC standard 4-layer  
board. θJA values are approximate.  
2.0  
THERMAL RESISTANCE  
1.8  
1.6  
1.4  
θJA is specified for the device soldered to a high thermal  
conductivity 4-layer (2s2p) circuit board, as described in  
EIA/JESD 51-7.  
16-LEAD QSOP  
1.2  
Table 3.  
1.0  
Package Type  
16-Lead QSOP  
20-Lead TSSOP  
θJA  
θJC  
23  
45  
Unit  
°C/W  
°C/W  
0.8  
20-LEAD TSSOP  
105  
143  
0.6  
0.4  
0.2  
0
MAXIMUM POWER DISSIPATION  
The maximum safe power dissipation in the ADA4420-6  
package is limited by the associated rise in junction temperature  
(TJ) on the die. At approximately 150°C, which is the glass  
transition temperature, the plastic changes its properties. Even  
temporarily exceeding this temperature limit can change the  
stresses that the package exerts on the die, permanently shifting  
the parametric performance of the ADA4420-6. Exceeding a  
junction temperature of 150°C for an extended time can result  
in changes in the silicon devices, potentially causing failure.  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
AMBIENT TEMPERATURE (°C)  
Figure 2. Maximum Power Dissipation vs.  
Ambient Temperature for a 4-Layer Board  
ESD CAUTION  
Rev. A | Page 4 of 16  
 
 
 
 
 
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