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ADA4411-3ARQZ-RL PDF预览

ADA4411-3ARQZ-RL

更新时间： 2024-02-10 16:05:09
品牌 Logo 应用领域
亚德诺 - ADI 消费电路商用集成电路光电二极管
页数 文件大小 规格书
16页 395K
描述
Integrated Triple Video Filter and Buffer with Selectable Cutoff Frequencies and Multiplexed Inputs for RGB, HD/SD

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ADA4411-3ARQZ-RL 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SSOP
包装说明：SSOP, SSOP24,.24针数：24
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.09
Is Samacsys：N其他特性：IT CAN ALSO OPERATE WITH 4.5V TO 12V SINGLE SUPPLY
商用集成电路类型：CONSUMER CIRCUITJESD-30 代码：R-PDSO-G24
JESD-609代码：e3长度：8.6614 mm
湿度敏感等级：1功能数量：1
端子数量：24最高工作温度：85 °C
最低工作温度：-40 °C封装主体材料：PLASTIC/EPOXY
封装代码：SSOP封装等效代码：SSOP24,.24
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, SHRINK PITCH
峰值回流温度（摄氏度）：260电源：+-5 V
认证状态：Not Qualified座面最大高度：1.7526 mm
子类别：Other Consumer ICs最大压摆率：60 mA
最大供电电压 (Vsup)：6 V最小供电电压 (Vsup)：2.25 V
表面贴装：YES温度等级：INDUSTRIAL
端子面层：Matte Tin (Sn)端子形式：GULL WING
端子节距：0.635 mm端子位置：DUAL
处于峰值回流温度下的最长时间：40宽度：3.9116 mm
Base Number Matches：1

ADA4411-3ARQZ-RL 数据手册

 浏览型号ADA4411-3ARQZ-RL的Datasheet PDF文件第2页浏览型号ADA4411-3ARQZ-RL的Datasheet PDF文件第3页浏览型号ADA4411-3ARQZ-RL的Datasheet PDF文件第4页浏览型号ADA4411-3ARQZ-RL的Datasheet PDF文件第6页浏览型号ADA4411-3ARQZ-RL的Datasheet PDF文件第7页浏览型号ADA4411-3ARQZ-RL的Datasheet PDF文件第8页 
ADA4411-3  
ABSOLUTE MAXIMUM RATINGS  
Table 3.  
Parameter  
Supply Voltage  
Power Dissipation  
Storage Temperature  
Operating Temperature Range  
Lead Temperature Range (Soldering 10 sec)  
Junction Temperature  
The power dissipated in the package (PD) is the sum of the  
Rating  
quiescent power dissipation and the power dissipated in the  
package due to the load drive for all outputs. The quiescent  
power is the voltage between the supply pins (VS) times the  
quiescent current (IS). The power dissipated due to load drive  
depends on the particular application. For each output, the  
power due to load drive is calculated by multiplying the load  
current by the associated voltage drop across the device. The  
power dissipated due to all of the loads is equal to the sum of  
the power dissipations due to each individual load. RMS  
voltages and currents must be used in these calculations.  
12 V  
See Figure 2  
–6±°C to +12±°C  
–40°C to +8±°C  
300°C  
1±0°C  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Airflow increases heat dissipation, effectively reducing θJA.  
In addition, more metal directly in contact with the package  
leads from metal traces, through-holes, ground, and power  
planes reduces the θJA.  
THERMAL RESISTANCE  
Figure 2 shows the maximum safe power dissipation in the  
package vs. the ambient temperature for the 24-lead QSOP  
(83°C/W) on a JEDEC standard 4-layer board. θJA values are  
approximations.  
θJA is specified for the worst-case conditions, that is, θJA is  
specified for device soldered in circuit board for surface-mount  
packages.  
Table 4. Thermal Resistance  
Package Type  
24 Lead QSOP  
2.5  
2.3  
2.1  
1.9  
1.7  
1.5  
1.3  
1.1  
0.9  
0.7  
0.5  
θJA  
Unit  
83  
°C/W  
Maximum Power Dissipation  
The maximum safe power dissipation in the ADA4411-3  
package is limited by the associated rise in junction temperature  
(TJ) on the die. At approximately 15ꢀ°C, which is the glass  
transition temperature, the plastic changes its properties.  
Even temporarily exceeding this temperature limit may change  
the stresses that the package exerts on the die, permanently  
shifting the parametric performance of the ADA4411-3.  
Exceeding a junction temperature of 15ꢀ°C for an extended  
period can result in changes in the silicon devices potentially  
causing failure.  
–40  
–20  
0
20  
40  
60  
80  
AMBIENT TEMPERATURE (°C)  
Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on  
the human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. 0 | Page ± of 16  
 
 
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