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ADA3200AEK3AR

更新时间： 2022-04-23 23:00:11

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超微 - AMD		/
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AMD Athlon⑩ 64 Processor Power and Thermal Data Sheet

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ADA3200AEK3AR 数据手册

PID: 30430 Rev 3.51 March 2006

AMD Athlon™ 64 Processor Power and Thermal Data Sheet

Table 1: Revision History

Date

Revision Description

March 2006

3.51

Added three AMD Turion™ 64 Mobile Technology OPNS: TMSMT32BQX4LD,

TMSMT34BQX5LD, and TMSMT37BQX5LD.

March 2006

3.47

Added OPNs across all processor brands. Added new Section 5

AMD Athlon™ 64 X2 Dual Core Processor. Added new Section 6 MTOPS.

October 2004

3.43

3.41

Added OPN for model 4000+ desktop

Added FX-55 OPN. Added desktop OPNs for models 3000+, 3200+, and 3500+.

Documented T

max parameter for all OPNs. Removed chapters 3, 4, and 6.

CONTROL

August 2004

3.37

Added AMD Sempron™ Processor and Mobile AMD Sempron™ Processor chapters.

Removed model 3100+ 62W OPN. Added DTR Model 3700+ OPN.

July 2004

June 2004

3.29

3.25

Added model 3400+ 62W mobile OPN.

Added rev CG 89W model 3500+, 3700+, and 3800+ OPNs. Added FX-53 939 pin

package OPN. Added one decimal precision to some IDD numbers. Updated

document references.

May 2004

3.21

3.19

3.17

3.15

3.13

Added rev CG 35W models 2700+ and 2800+.

Removed rev CG 35W OPN.

April 2004

March 2004

Corrected model number formatting for DTR OPNs.

Added rev CG 35W model 2700+ OPN.

Added rev CG model 2800+, 3000+, and 3200+ 89W OPNs. Added FX-53 940 pin

package OPN. Corrected note for C3 state on all Power/Thermal Specification tables.

Added package drawing references for lidless parts in OPN decode section.

January 2004

3.11

Added rev CG entries for existing rev C0 parts. Corrected Max FID code for model

3200+ 62W mobile OPN. Updated FX-51 Halt/Stop Grant power number. Revised

IDD Max and TDP for Intermediate P-state #2 for 754 pin lidless package Rev C0

DTR Model 3200+.

January 2004

3.07

Added model 3400+ DT and DTR parts. Added model 2800+, 3000+, and 3200+ 62W

Mobile parts.

December 2003

November 2003

3.06

3.05

Added model 3000+ desktop part.

General clean up. Updated S3 I/O power for non-FX parts. Fixed mobile OPN

example. Added thermal resistance specifications for all OPNs.

September 2003

3.02

3.00

Changed min P-state information to N/A in Table 8, and removed unreleased entries

from Table 4 and Table 14.

Initial public release.

1...4 5 678 9 10...95

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