Datasheet > AD8398ACPZ-R2

AD8398ACPZ-R2

更新时间： 2024-01-08 22:29:51

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
13页	389K
描述
VDSL, Dual Line Driver with Shutdown

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中文翻译

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技术参数
数据手册

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AD8398ACPZ-R2 技术参数

Source Url Status Check Date：	2013-05-01 14:56:26.233	是否无铅：	含铅
是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	CSP	针数：	16
Reach Compliance Code：	compliant	风险等级：	5.76
JESD-609代码：	e3	湿度敏感等级：	3
端子面层：	Matte Tin (Sn)	Base Number Matches：	1

AD8398ACPZ-R2 数据手册

AD8398A

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

MAXIMUM POWER DISSIPATION

Parameter

Rating

The maximum safe power dissipation for the AD8398A is limited

by its junction temperature (T_J) on the die. The maximum safe

T_Jof plastic encapsulated devices, as determined by the glass

transition temperature of the plastic, is 150°C. Temporarily

exceeding this limit may cause a shift in the parametric

performance due to a change in the stresses exerted on the

die by the package. Exceeding this limit for an extended period

can result in device failure.

Power Supplies (V_CC− V_EE)

Power Dissipation

Storage Temperature Range

Operating Temperature Range

Lead Temperature (Soldering, 10 sec)

Junction Temperature

13.2 V

(T_{J MAX}− T_A)/θ_JA

−65°C to +125°C

−40°C to +85°C

300°C

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 16-lead LFCSP_WQ

on a 4-layer board with six vias connecting the exposed pad to

the GND plane layer.

= 150°C

THERMAL RESISTANCE

θ_JAis specified with the device soldered on a JEDEC circuit board

and the thermal pad connected to the GND plane layer using

six vias.

Table 3. Thermal Resistance

Package Type

θ_JA

Unit

16-Lead LFCSP_WQ

35.6

°C/W

–40 –30 –20 –10

10 20 30 40 50 60 70 80

AMBIENT TEMPERATURE (°C)

Figure 3. Maximum Safe Power Dissipation vs. Ambient Temperature,

4-Layer JEDEC Board with Six Thermal Vias

ESD CAUTION

Rev. E | Page 4 of 12

1 2 3 456 7 8...13

中文翻译

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与AD8398ACPZ-R2相关器件

型号	品牌	获取价格	描述	数据表
AD8398ACPZ-R7	ADI	获取价格	VDSL, Dual Line Driver with Shutdown
AD8398ACPZ-RL	ADI	获取价格	VDSL, Dual Line Driver with Shutdown
AD83C151C-12	TEMIC	获取价格	CMOS 0 to 36 MHz Single Chip 8-bit Microcontroller
AD83C151C-16	TEMIC	获取价格	CMOS 0 to 36 MHz Single Chip 8-bit Microcontroller
AD83C151C-20	TEMIC	获取价格	CMOS 0 to 36 MHz Single Chip 8-bit Microcontroller
AD83C151C-25	TEMIC	获取价格	CMOS 0 to 36 MHz Single Chip 8-bit Microcontroller
AD83C151C-30	TEMIC	获取价格	CMOS 0 to 36 MHz Single Chip 8-bit Microcontroller
AD83C151C-36	TEMIC	获取价格	CMOS 0 to 36 MHz Single Chip 8-bit Microcontroller
AD83C151C-L16	TEMIC	获取价格	CMOS 0 to 36 MHz Single Chip 8-bit Microcontroller
AD83C154	TEMIC	获取价格	Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, CMOS, CDIP40,

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