Datasheet > AD823A-2ARM-EBZ

AD823A-2ARM-EBZ

更新时间： 2022-10-09 09:18:41

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
20页	509K
描述
Wide Supply Dual, 17 MHz, Rail-to-Rail

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AD823A-2ARM-EBZ 数据手册

AD823A

Data Sheet

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 4.

θ_JAis specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Parameter

Rating

Supply Voltage

36 V

Power Dissipation

See Figure 4

V_S0.ꢀ V

V_S

See Figure 4

−65°C to +125°C

−40°C to +85°C

300°C

The specification is for the device in free air.

Input Voltage (Common Mode)

Differential Input Voltage

Output Short-Circuit Duration

Storage Temperature Range

Operating Temperature Range

Lead Temperature (Soldering, 10 sec)

ESD Ratings (Human Body Model)

ESD Ratings (Charged Device Model)

Table 5. Thermal Resistance

Package Type

8-Lead SOIC_N

8-Lead MSOP

θ_JA

Unit

°C/W

120

133

2.0

1.5

1.0

0.5

4500 V

1250 V

= 150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

8-LEAD SOIC

8-LEAD MSOP

Use the part with caution at the 30 V supply as excessive output

current may overheat and damage the part.

–45 –35 –25 –15 –5

15 25 35 45 55 65 75 85

AMBIENT TEMPERATURE (°C)

Figure 4. Maximum Power Dissipation vs. Temperature

ESD CAUTION

Rev. B | Page 6 of 20

1...3 4 567 8 9...20

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