AD8222HBCPZ-R7

更新时间： 2024-01-03 11:35:38

品牌	Logo	应用领域
亚德诺 - ADI		仪表放大器
页数	文件大小	规格书
24页	417K
描述
Precision, Dual-Channel Instrumentation Amplifier

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数据手册

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AD8222HBCPZ-R7 数据手册

AD8222

ABSOLUTE MAXIMUM RATINGS

Table 5.

THERMAL RESISTANCE

Parameter

Rating

Table 6.

Package

Supply Voltage

18 V

Indefinite

V_S

−65°C to +130°C

−40°C to +125°C

130°C

θ_JA

Unit

°C/W

Output Short-Circuit Current Duration

Input Voltage (Common Mode)

Differential Input Voltage

Storage Temperature Range

Operational Temperature Range

Package Glass Transition Temperature (T_G)

ESD

CP-16-19: LFCSP Without Thermal Pad

CP-16-13: LFCSP with Thermal Pad

The θ_JAvalues in Table 6 assume a 4-layer JEDEC standard

board. For the LFCSP with thermal pad, it is assumed that the

thermal pad is soldered to a landing on the PCB board, with the

landing thermally connected to a heat dissipating power plane.

θ_JCat the exposed pad is 4.4°C/W.

Human Body Model

Charge Device Model

1 kV

Maximum Power Dissipation

The maximum safe power dissipation for the AD8222 is limited

by the associated rise in junction temperature (T_J) on the die. At

approximately 130C, which is the glass transition temperature,

the plastic changes its properties. Even temporarily exceeding

this temperature limit may change the stresses that the package

exerts on the die, permanently shifting the parametric performance

of the amplifiers. Exceeding a temperature of 130°C for an

extended period can result in a loss of functionality.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions may affect device reliability.

ESD CAUTION

Rev. A | Page 6 of 24

1...3 4 567 8 9...24

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