AD815
ABSOLUTE MAXIMUM RATINGS1
MAXIMUM POWER DISSIPATION
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Total
The maximum power that can be safely dissipated by the AD815
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for the plastic encapsulated
parts is determined by the glass transition temperature of the
plastic, about 150°C. Exceeding this limit temporarily may
cause a shift in parametric performance due to a change in the
stresses exerted on the die by the package. Exceeding a junction
temperature of 175°C for an extended period can result in
device failure.
Internal Power Dissipation2
Plastic (Y and VR) . . 3.05 Watts (Observe Derating Curves)
Small Outline (RB) . . 2.4 Watts (Observe Derating Curves)
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ±VS
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . ±6 V
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Can Only Short to Ground
Storage Temperature Range
Y, VR and RB Package . . . . . . . . . . . . . . . –65°C to +125°C
Operating Temperature Range
AD815A . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Lead Temperature Range (Soldering, 10 sec) . . . . . . . +300°C
The AD815 has thermal shutdown protection, which guarantees
that the maximum junction temperature of the die remains below a
safe level, even when the output is shorted to ground. Shorting
the output to either power supply will result in device failure.
To ensure proper operation, it is important to observe the
derating curves and refer to the section on power considerations.
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
It must also be noted that in high (noninverting) gain configurations
(with low values of gain resistor), a high level of input overdrive
can result in a large input error current, which may result in a
significant power dissipation in the input stage. This power
must be included when computing the junction temperature rise
due to total internal power.
2Specification is for device in free air with 0 ft/min air flow: 15-Lead Through-Hole
and Surface Mount: θJA = 41°C/W; 24-Lead Surface Mount: θJA = 52°C/W.
PIN CONFIGURATION
24-Lead Thermally-Enhanced SOIC (RB-24)
14
T
= 150؇C
J
13
12
11
θJA = 16؇C/W
1
2
24
23
22
21
20
19
18
17
16
NC
NC
NC
NC
NC
NC
NC
NC
SOLDERED DOWN TO
COPPER HEAT SINK
(STILL AIR = 0FT/MIN)
10
9
3
AD815 AVR, AY
8
4
7
6
θJA = 41؇C/W
(STILL AIR = 0FT/MIN)
5
AD815
TOP VIEW
THERMAL
HEAT TABS
THERMAL
HEAT TABS
6
NO HEAT SINK
5
4
(Not to Scale)
7
AD815 AVR, AY
+V
*
+V
*
S
S
8
3
θJA = 52؇C/W
(STILL AIR = 0 FT/MIN)
NO HEAT SINK
+IN1
–IN1
9
+IN2
2
1
AD815ARB-24
10
15 –IN2
0
OUT1 11
–V
14 OUT2
–50 –40 –30 –20 –10
0
10 20 30 40 50 60 70 80 90
12
13 +V
S
S
AMBIENT TEMPERATURE – ؇C
NC = NO CONNECT
*HEAT TABS ARE CONNECTED TO THE POSITIVE SUPPLY.
Plot of Maximum Power Dissipation vs. Temperature
ORDERING GUIDE
Package Description
Model
Temperature Range
Package Option
AD815ARB-24
AD815ARB-24-REEL
AD815AVR
AD815AY
AD815AYS
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
24-Lead Thermally Enhanced SOIC
24-Lead Thermally Enhanced SOIC
15-Lead Surface Mount DDPAK
15-Lead Through-Hole SIP with Staggered Leads and 90° Lead Form
15-Lead Through-Hole SIP with Staggered Leads and Straight Lead Form
Evaluation Board
RB-24
RB-24
VR-15
Y-15
YS-15
AD815-EB
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD815 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. B
–3–
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