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AD8133ACP-REEL

更新时间： 2024-01-22 04:34:12
品牌 Logo 应用领域
亚德诺 - ADI 驱动器
页数 文件大小 规格书
16页 625K
描述
Triple Differential Driver With Output Pull-Down

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AD8133ACP-REEL 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：QFN
包装说明：HVQCCN,针数：24
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.14
差分输出：YES驱动器位数：3
输入特性：DIFFERENTIAL接口集成电路类型：LINE DRIVER
接口标准：GENERAL PURPOSEJESD-30 代码：S-XQCC-N24
JESD-609代码：e3长度：4 mm
湿度敏感等级：3标称负供电电压：-5 V
功能数量：3端子数量：24
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：UNSPECIFIED封装代码：HVQCCN
封装形状：SQUARE封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）：260认证状态：Not Qualified
最大接收延迟：座面最大高度：1 mm
最大供电电压：6 V最小供电电压：4.5 V
标称供电电压：5 V表面贴装：YES
技术：BIPOLAR温度等级：INDUSTRIAL
端子面层：Matte Tin (Sn)端子形式：NO LEAD
端子节距：0.5 mm端子位置：QUAD
处于峰值回流温度下的最长时间：40宽度：4 mm
Base Number Matches：1

AD8133ACP-REEL 数据手册

 浏览型号AD8133ACP-REEL的Datasheet PDF文件第2页浏览型号AD8133ACP-REEL的Datasheet PDF文件第3页浏览型号AD8133ACP-REEL的Datasheet PDF文件第4页浏览型号AD8133ACP-REEL的Datasheet PDF文件第6页浏览型号AD8133ACP-REEL的Datasheet PDF文件第7页浏览型号AD8133ACP-REEL的Datasheet PDF文件第8页 
AD8133  
ABSOLUTE MAXIMUM RATINGS  
The power dissipated in the package (PD) is the sum of the  
Table 3.  
quiescent power dissipation and the power dissipated in the  
package due to the load drive for all outputs. The quiescent  
power is the voltage between the supply pins (VS) times the  
quiescent current (IS). The load current consists of differential  
and common-mode currents flowing to the loads, as well as  
currents flowing through the internal differential and common-  
mode feedback loops. The internal resistor tap used in the  
common-mode feedback loop places a 4 kΩ differential load on  
the output. RMS output voltages should be considered when  
dealing with ac signals.  
Parameter  
Rating  
Supply Voltage  
12 V  
All VOCM  
VS  
Power Dissipation  
Input Common-Mode Voltage  
Storage Temperature  
Operating Temperature Range  
Lead Temperature Range  
(Soldering 10 sec)  
See Figure 3  
VS  
−65°C to +125°C  
−40°C to +85°C  
300°C  
Junction Temperature  
150°C  
Airflow reduces θJA. Also, more metal directly in contact with  
the package leads from metal traces, through holes, ground,  
and power planes reduces the θJA. The exposed paddle on the  
underside of the package must be soldered to a pad on the PCB  
surface that is thermally connected to a copper plane in order to  
achieve the specified θJA.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress rat-  
ing only and functional operation of the device at these or any  
other conditions above those indicated in the operational sec-  
tion of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Figure 3 shows the maximum safe power dissipation in the  
package versus ambient temperature for the 24-lead LFCSP  
(70°C/W) package on a JEDEC standard 4-layer board with the  
underside paddle soldered to a pad that is thermally connected  
to a PCB plane. θJA values are approximations.  
THERMAL RESISTANCE  
θJA is specified for the worst-case conditions, i.e., θJA is specified  
for the device soldered in a circuit board in still air.  
Table 4. Thermal Resistance with the Underside Pad  
Connected to the Plane  
4.0  
3.5  
Package Type/PCB Type  
θJA  
Unit  
24-Lead LFCSP/4-Layer  
70  
°C/W  
3.0  
2.5  
2.0  
Maximum Power Dissipation  
The maximum safe power dissipation in the AD8133 package is  
limited by the associated rise in junction temperature (TJ) on  
the die. At approximately 150°C, which is the glass transition  
temperature, the plastic changes its properties. Even temporarily  
exceeding this temperature limit may change the stresses that  
the package exerts on the die, permanently shifting the para-  
metric performance of the AD8133. Exceeding a junction tem-  
perature of 175°C for an extended period of time can result in  
changes in the silicon devices potentially causing failure.  
1.5  
LFCSP  
1.0  
0.5  
0
–40  
–20  
0
20  
40  
60  
80  
AMBIENT TEMPERATURE (°C)  
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the  
human body and test equipment and can discharge without detection. Although this product features proprie-  
tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic  
discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of  
functionality.  
Rev. 0 | Page 5 of 16  
 
 
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