C
ꢂ74ꢀ4/ ꢂ74ꢀ.
-SOLUTECM XIMUMCR TINGSC
Table 2.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
Rating
VDD to GND
−0.3 V to +7 V
−0.3 V to +7 V
−0.3 V to +7 V
−0.3 V to +7 V
−0.3 V to +7 V
−40°C to +12ꢀ°C
−6ꢀ°C to +1ꢀ0°C
1ꢀ0°C
SDA Input Voltage to GND
SDA Output Voltage to GND
SCL Input Voltage to GND
ALERT Output Voltage to GND
Operating Temperature Range
Storage Temperature Range
Junction Temperature
ꢀ-Lead SOT-23 (RJ-ꢀ)
Power Dissipation1, 2
Thermal Impedance3
θJA, Junction-to-Ambient
(still air)
WMAX = (TJMAX − TA)/θJA
240°C/W
6-Lead SOT-23 (RJ-6)
Power Dissipation1, 2
Thermal Impedance3
WMAX = (TJMAX − TA)/θJA
190.4°C/W
θJA, Junction-to-Ambient
(still air)
8-Lead MSOP (RM-8)
Power Dissipation1, 2
Thermal Impedance3
WMAX = (TJMAX − TA)/θJA
θJA, Junction-to-Ambient
(still air)
θJC, Junction-to-Case
IR Reflow Soldering
Peak Temperature
20ꢀ.9°C/W
43.74°C/W
220°C (0°C/ꢀ°C)
10 sec to 20 sec
3°C/s max
Time at Peak Temperature
Ramp-up Rate
Ramp-down Rate
−6°C/s max
Ramp from 2ꢀ°C to Peak
Temperature
6 minutes max
IR Reflow Soldering in Pb-Free
Package
Peak Temperature
Time at Peak Temperature
Ramp Rate
260°C (0°C)
20 sec to 40 sec
3°C/s max
Ramp-Down Rate
−6°C/s max
Ramp from 2ꢀ°C to Peak
Temperature
8 minutes max
1 Values relate to package being used on a standard 2-layer PCB.
2 TA = ambient temperature.
3 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, such as components mounted on a heat sink.
Junction-to-ambient resistance is more useful for air-cooled, PCB-mounted
components.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. E | Page ꢀ of 20