AD680
ABSO LUTE MAXIMUM RATINGS*
TH EO RY O F O P ERATIO N
VIN to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V
Power Dissipation (25°C) . . . . . . . . . . . . . . . . . . . . . . 500 mW
Storage T emperature . . . . . . . . . . . . . . . . . . . –65°C to +125°C
Lead T emperature (Soldering, 10 sec) . . . . . . . . . . . . . . 300°C
Package T hermal Resistance
Bandgap references are the high performance solution for low
supply voltage operation. A typical precision bandgap will con-
sist of a reference core and buffer amplifier. Based on a new,
patented bandgap reference design (Figure 2), the AD680
merges the amplifier and the core bandgap function to produce
a compact, complete precision reference. Central to the device
is a high gain amplifier with an intentionally large Proportional
T o Absolute T emperature (PT AT ) input offset. T his offset is
controlled by the area ratio of the amplifier input pair, Q1 and
Q2, and is developed across resistor R1. T ransistor Q12’s base
emitter voltage has a Complementary T o Absolute T emperature
(CT AT ) characteristic. Resistor R2 and the parallel combina-
tion of R3 and R4 “multiply” the PT AT voltage across R1.
T rimming resistors R3 and R4 to the proper ratio produces a
temperature invariant 2.5 V at the output. T he result is an
accurate, stable output voltage accomplished with a minimum
number of components.
θ
JA (All Packages) . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
Output Protection: Output safe for indefinite short to ground
and momentary short to VIN.
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. T his is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
8-P in P lastic D IP
and
8-P in SO IC P ackages
+V
IN
1
2
3
4
TP*
8
7
6
5
TP*
TP*
V
+V
AD680
TOP VIEW
(Not to Scale)
IN
TEMP
GND
Q9
Q8
OUT
NC
Q11
Q3
Q2
Q4
V
OUT
NC = NO CONNECT
Q5
Q1
1x
*TP DENOTES FACTORY TEST POINT.
NO CONNECTIONS SHOULD BE MADE
TO THESE PINS.
R1
R2
R3
R4
R5
8x
C1
Q10
Q12
TO -92 P ackage
Q6
Q7
R6
R7
AD680
BOTTOM VIEW
(Not to Scale)
TEMP
GND
3
2
1
Figure 2. AD680 Schem atic Diagram
+V
V
GND
IN
OUT
An additional feature with this approach is the ability to mini-
mize the noise while maintaining very low overall power
dissipation for the entire circuit. Frequently it is difficult to
independently control the dominant noise sources for bandgap
references: bandgap transistor noise and resistor thermal noise.
By properly choosing the operating currents of Q1 and Q2 and
separately sizing R1, low wideband noise is realized while main-
taining 1 mW typical power dissipation.
Figure 1. Connection Diagram s
O RD ERING GUID E
Initial Tem perature
Error
m V
Coeff.
ppm /°C
Tem perature
Range
P ackage
D escription
P ackage
O ption*
Model
AD680JN
AD680JR
AD680JT
AD680AN
AD680AR
10
10
10
5
25
25
30
20
20
0°C to +70°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
Plastic
SOIC
T O-92
Plastic
SOIC
N-8
SO-8
T O-92
N-8
5
SO-8
*N = Plastic DIP Package; SO = SOIC Package; T = T O-92 Package.
REV. C
–3–