5秒后页面跳转
捷配首页

Datasheet > AD677KNZ
AD677KNZ PDF预览

AD677KNZ

更新时间： 2024-02-26 09:52:36
品牌 Logo 应用领域
其他 - ETC 转换器光电二极管信息通信管理PC
页数 文件大小 规格书
12页 149K
描述
MICROCIRCUIT, DIGITAL-LINEAR, FAST, SERIAL, 16-BIT, A/D CONVERTER, MULTICHIP SILICON

阅读下载

中文翻译

获取价格

AD677KNZ 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SOIC
包装说明：SOP, SOP28,.4针数：28
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.08
最大模拟输入电压：10 V最小模拟输入电压：-10 V
转换器类型：ADC, SUCCESSIVE APPROXIMATIONJESD-30 代码：R-PDSO-G28
JESD-609代码：e3长度：17.9 mm
最大线性误差 (EL)：0.0023%湿度敏感等级：5
标称负供电电压：-12 V模拟输入通道数量：1
位数：16功能数量：1
端子数量：28最高工作温度：70 °C
最低工作温度：输出位码：BINARY
输出格式：SERIAL封装主体材料：PLASTIC/EPOXY
封装代码：SOP封装等效代码：SOP28,.4
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：260电源：5,+-12 V
认证状态：Not Qualified采样速率：0.1 MHz
采样并保持/跟踪并保持：SAMPLE座面最大高度：2.65 mm
子类别：Analog to Digital Converters标称供电电压：12 V
表面贴装：YES技术：BICMOS
温度等级：COMMERCIAL端子面层：Matte Tin (Sn)
端子形式：GULL WING端子节距：1.27 mm
端子位置：DUAL处于峰值回流温度下的最长时间：30
宽度：7.5 mmBase Number Matches：1

AD677KNZ 数据手册

 浏览型号AD677KNZ的Datasheet PDF文件第6页浏览型号AD677KNZ的Datasheet PDF文件第7页浏览型号AD677KNZ的Datasheet PDF文件第8页浏览型号AD677KNZ的Datasheet PDF文件第10页浏览型号AD677KNZ的Datasheet PDF文件第11页浏览型号AD677KNZ的Datasheet PDF文件第12页 
4. VERIFICATION  
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with  
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan  
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in  
accordance with MIL-PRF-38535, appendix A.  
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted  
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in  
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.  
4.2.1 Additional criteria for device class M.  
a. Burn-in test, method 1015 of MIL-STD-883.  
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision  
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall  
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in  
method 1015 of MIL-STD-883.  
(2) TA = +125°C, minimum.  
b. Interim and final electrical test parameters shall be as specified in table II herein.  
4.2.2 Additional criteria for device classes Q and V.  
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the  
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under  
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with  
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall  
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in  
method 1015 of MIL-STD-883.  
b. Interim and final electrical test parameters shall be as specified in table II herein.  
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in  
MIL-PRF-38535, appendix B.  
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in  
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups  
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).  
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with  
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for  
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed  
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections  
(see 4.4.1 through 4.4.4).  
SIZE  
STANDARD  
5962-95592  
A
MICROCIRCUIT DRAWING  
DLA LAND AND MARITIME  
REVISION LEVEL  
B
SHEET  
COLUMBUS, OHIO 43218-3990  
9
DSCC FORM 2234  
APR 97  
1...6789101112

中文翻译

下载PDF

与AD677KNZ相关器件

型号 品牌 获取价格 描述 数据表
AD677KR ADI

获取价格

 		16-Bit 100 kSPS Sampling ADC
AD677KR ROCHESTER

获取价格

 		1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO28, PLASTIC, SOIC-28
AD677KRZ ROCHESTER

获取价格

 		1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO28, PLASTIC, SOIC-28
AD677KRZ-REEL ADI

获取价格

 		16-Bit, Serial, 100 kSPS Sampling ADC.
AD677TD ADI

获取价格

 		MICROCIRCUIT, DIGITAL-LINEAR, FAST, SERIAL, 16-BIT, A/D CONVERTER, MULTICHIP SILICON
AD677TD/883B ETC

获取价格

 		Analog-to-Digital Converter， 16-Bit
AD677TD883B ADI

获取价格

 		MICROCIRCUIT, DIGITAL-LINEAR, FAST, SERIAL, 16-BIT, A/D CONVERTER, MULTICHIP SILICON
AD678 ADI

获取价格

 		12-Bit 200 kSPS Complete Sampling ADC
AD678* ETC

获取价格

 		12-Bit 200 kSPS Complete Sampling ADC
AD678AD ADI

获取价格

 		12-Bit 200 kSPS Complete Sampling ADC

与AD677KNZ相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证