AD592
+15V
+5V
Response of the AD592 output to abrupt changes in ambient
temperature can be modeled by a single time constant τ expo-
nential function. Figure 8 shows typical response time plots for
several media of interest.
AD592
AD592
AD592
AD592
100
C
A
D
B
90
80
70
60
50
40
30
20
10
333.3Ω
(0.1%)
V
(1mV/K)
TAVG
10kΩ
(0.1%)
E
V
(10mV/K)
TAVG
F
A ALUMINUM BLOCK
B FLUORINERT LIQUID
C MOVING AIR (WITH HEAT SINK)
D MOVING AIR (WITHOUT HEAT SINK)
E STILL AIR (WITH HEAT SINK)
F STILL AIR (WITHOUT HEAT SINK)
Figure 9. Average and Minimum Temperature
Connections
The circuit of Figure 10 demonstrates a method in which a
voltage output can be derived in a differential temperature
measurement.
0
20 40 60 80 100 120 140 160 180 200 220 240 260 280 300
TIME – sec
+V
10kΩ
Figure 8. Thermal Response Curves
AD592
AD741
The time constant, τ, is dependent on θJA and the thermal ca-
pacities of the chip and the package. Table I lists the effective τ
(time to reach 63.2% of the final value) for several different
media. Copper printed circuit board connections where ne-
glected in the analysis, however, they will sink or conduct heat
directly through the AD592’s solder dipped Kovar leads. When
faster response is required a thermally conductive grease or glue
between the AD592 and the surface temperature being mea-
sured should be used. In free air applications a clip-on heat sink
will decrease output stabilization time by 10-20%.
5MΩ
R1
50kΩ
AD592
V
= (T – T ) x
1 2
OUT
(10mV/ C)
o
10kΩ
–V
Figure 10. Differential Measurements
R1 can be used to trim out the inherent offset between the two
devices. By increasing the gain resistor (10 kΩ) temperature
measurements can be made with higher resolution. If the magni-
tude of V+ and V– is not the same, the difference in power con-
sumption between the two devices can cause a differential
self-heating error.
MOUNTING CONSIDERATIONS
If the AD592 is thermally attached and properly protected, it
can be used in any temperature measuring situation where the
maximum range of temperatures encountered is between –25°C
and +105°C. Because plastic IC packaging technology is em-
ployed, excessive mechanical stress must be safeguarded against
when fastening the device with a clamp or screw-on heat tab.
Thermally conductive epoxy or glue is recommended under
typical mounting conditions. In wet or corrosive environments,
any electrically isolated metal or ceramic well can be used to
shield the AD592. Condensation at cold temperatures can cause
leakage current related errors and should be avoided by sealing
the device in nonconductive epoxy paint or dips.
Cold junction compensation (CJC) used in thermocouple signal
conditioning can be implemented using an AD592 in the circuit
configuration of Figure 11. Expensive simulated ice baths or
hard to trim, inaccurate bridge circuits are no longer required.
THERMOCOUPLE
TYPE
APPROX.
R VALUE
J
52Ω
41Ω
41Ω
61Ω
6Ω
+7.5V
K
T
E
S
R
2.5V
AD1403
6Ω
MEASURING
JUNCTION
10kΩ
APPLICATIONS
AD OP07E
1kΩ
Cu
V
Connecting several AD592 devices in parallel adds the currents
through them and produces a reading proportional to the aver-
age temperature. Series AD592s will indicate the lowest tem-
perature because the coldest device limits the series current
flowing through the sensors. Both of these circuits are depicted
in Figure 9.
OUT
100kΩ
AD592
R
G2
REFERENCE
JUNCTION
R
(1kΩ)
G1
Cu
R
Figure 11. Thermocouple Cold Junction Compensation
–6–
REV. A