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AD5304BRM-REEL7 PDF预览

AD5304BRM-REEL7

更新时间: 2024-02-14 10:34:40
品牌 Logo 应用领域
亚德诺 - ADI /
页数 文件大小 规格书
24页 357K
描述
2.5 V to 5.5 V, 500 μA, Quad Voltage Output 8-/10-/12-Bit DACs in 10-Lead Packages

AD5304BRM-REEL7 技术参数

Source Url Status Check Date:2013-05-01 14:56:11.767是否无铅: 含铅
是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSSOP包装说明:TSSOP, TSSOP10,.19,20
针数:10Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:7.57最大模拟输出电压:5.499 V
最小模拟输出电压:0.001 V转换器类型:D/A CONVERTER
输入位码:BINARY输入格式:SERIAL
JESD-30 代码:S-PDSO-G10JESD-609代码:e0
长度:3 mm最大线性误差 (EL):0.2441%
湿度敏感等级:1位数:8
功能数量:1端子数量:10
最高工作温度:105 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP10,.19,20封装形状:SQUARE
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):240
电源:3/5 V认证状态:Not Qualified
座面最大高度:1.1 mm最大稳定时间:8 µs
标称安定时间 (tstl):6 µs子类别:Other Converters
最大压摆率:0.9 mA标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn85Pb15)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
宽度:3 mm

AD5304BRM-REEL7 数据手册

 浏览型号AD5304BRM-REEL7的Datasheet PDF文件第3页浏览型号AD5304BRM-REEL7的Datasheet PDF文件第4页浏览型号AD5304BRM-REEL7的Datasheet PDF文件第5页浏览型号AD5304BRM-REEL7的Datasheet PDF文件第7页浏览型号AD5304BRM-REEL7的Datasheet PDF文件第8页浏览型号AD5304BRM-REEL7的Datasheet PDF文件第9页 
AD5304/AD5314/AD5324  
Data Sheet  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Table 4.  
Parameter1  
Rating  
VDD to GND  
–0.3 V to +7 V  
Digital Input Voltage to GND  
Reference Input Voltage to GND  
VOUTA through VOUTD to GND  
Operating Temperature Range  
Industrial (A, B, W Version)  
Storage Temperature Range  
Junction Temperature (TJ max)  
10-Lead MSOP  
–0.3 V to VDD + 0.3 V  
–0.3 V to VDD + 0.3 V  
–0.3 V to VDD + 0.3 V  
–40°C to +105°C  
–65°C to +150°C  
150°C  
ESD CAUTION  
Power Dissipation  
(TJ max – TA)/ θJA  
206°C/W  
44°C/W  
θJA Thermal Impedance  
θJC Thermal Impedance  
10-Lead LFCSP  
Power Dissipation  
θJA Thermal Impedance  
Reflow Soldering  
(TJ max – TA)/ θJA  
84°C/W  
Peak Temperature (Pb-free)  
Peak Temperature (non Pb-free)  
Time at Peak Temperature  
260°C  
220°C  
10 sec to 40 sec  
1 Transient currents of up to 100 mA do not cause SCR latch-up.  
Rev. H | Page 6 of 24  
 

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