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AD1674JNZ PDF预览

AD1674JNZ

更新时间: 2024-01-05 10:11:40
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亚德诺 - ADI 转换器光电二极管信息通信管理
页数 文件大小 规格书
12页 258K
描述
12-Bit 100 kSPS A/D Converter

AD1674JNZ 数据手册

 浏览型号AD1674JNZ的Datasheet PDF文件第3页浏览型号AD1674JNZ的Datasheet PDF文件第4页浏览型号AD1674JNZ的Datasheet PDF文件第5页浏览型号AD1674JNZ的Datasheet PDF文件第7页浏览型号AD1674JNZ的Datasheet PDF文件第8页浏览型号AD1674JNZ的Datasheet PDF文件第9页 
AD1674  
TIMINGSTAND -ALO NE MO D E (F igur es 4a and 4b)  
J, K, A, B Grades  
Typ  
T Grade  
Typ  
P aram eter  
Sym bol  
Min  
Max  
Min  
Max  
Units  
Data Access T ime  
tDDR  
tHRL  
tDS  
tHDR  
tHS  
150  
150  
ns  
ns  
ns  
ns  
µs  
ns  
Low R/C Pulse Width  
ST S Delay from R/C  
Data Valid After R/C Low  
ST S Delay After Data Valid  
High R/C Pulse Width  
50  
50  
200  
1.2  
225  
1.2  
25  
0.6  
150  
25  
0.6  
150  
0.8  
0.8  
tHRH  
NOT E  
All min and max specifications are guaranteed.  
Specifications subject to change without notice.  
tHRL  
_
R/C  
_
R/C  
tHRH  
tDS  
tDS  
STS  
STS  
tC  
tDDR  
tHDR  
tC  
tHS  
tHDR  
HIGH-Z  
HIGH-Z  
DATA  
VALID  
DB11 – DB0  
HIGH-Z  
DATA  
VALID  
DB11 – DB0  
DATA VALID  
tHL  
Figure 4a. Stand-Alone Mode Tim ing Low Pulse for R/C  
Figure 4b. Stand-Alone Mode Tim ing High Pulse for R/C  
. . . . . . . . . . . . . . . . . . . . . . . . . . . Momentary Short to VCC  
Junction T emperature . . . . . . . . . . . . . . . . . . . . . . . . . +175°C  
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 825 mW  
Lead T emperature, Soldering (10 sec) . . . . . . . +300°C, 10 sec  
Storage T emperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C  
ABSO LUTE MAXIMUM RATINGS*  
VCC to Digital Common . . . . . . . . . . . . . . . . . . . 0 to + 16.5 V  
VEE to Digital Common . . . . . . . . . . . . . . . . . . . . . 0 to –16.5 V  
VLOGIC to Digital Common . . . . . . . . . . . . . . . . . . 0 V to +7 V  
Analog Common to Digital Common . . . . . . . . . . . . . . . ±1 V  
Digital Inputs to Digital Common . . . –0.5 V to VLOGIC +0.5 V  
Analog Inputs to Analog Common . . . . . . . . . . . . VEE to VCC  
20 VIN to Analog Common . . . . . . . . . . . . . . . . . VEE to +24 V  
REF OUT . . . . . . . . . . . . . . . . . Indefinite Short to Common  
*Stresses above those listed under “Absolute Maximum Ratings” may cause  
permanent damage to the device. T his is a stress rating only and functional  
operation of the device at these or any other conditions above those indicated in the  
operational section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect device reliability.  
CAUTIO N  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although  
the AD1674 features proprietary ESD protection circuitry, permanent damage may occur on  
devices subjected to high energy electrostatic discharges. T herefore, proper ESD precautions are  
recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
O RD ERING GUID E  
INL  
(TMIN to TMAX  
S/(N+D )  
(TMIN to TMAX  
P ackage  
D escription  
P ackage  
O ption2  
Model1  
Tem perature Range  
)
)
AD1674JN  
AD1674KN  
AD1674JR  
AD1674KR  
AD1674AR  
AD1674BR  
AD1674AD  
AD1674BD  
AD1674T D  
0°C to +70°C  
0°C to +70°C  
0°C to +70°C  
0°C to +70°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–55°C to +125°C  
±1 LSB  
±1/2 LSB  
±1 LSB  
±1/2 LSB  
±1 LSB  
±1/2 LSB  
±1 LSB  
69 dB  
70 dB  
69 dB  
70 dB  
69 dB  
70 dB  
69 dB  
70 dB  
70 dB  
Plastic DIP  
Plastic DIP  
N-28  
N-28  
R-28  
R-28  
R-28  
R-28  
D-28  
D-28  
D-28  
Plastic SOIC  
Plastic SOIC  
Plastic SOIC  
Plastic SOIC  
Ceramic DIP  
Ceramic DIP  
Ceramic DIP  
±1/2 LSB  
±1 LSB  
NOT ES  
1For details on grade and package offerings screened in accordance with MIL-ST D-883, refer to the Analog Devices Military Products Databook or current  
AD1674/883B data sheet. SMD is also available.  
2N = Plastic DIP; D = Hermetic Ceramic DIP; R = Plastic SOIC.  
–6–  
REV. C  

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