Datasheet > ACS138D

ACS138D

更新时间： 2022-12-11 21:07:03

品牌	Logo	应用领域
英特矽尔 - INTERSIL		解复用器
页数	文件大小	规格书
2页	52K
描述
Radiation Hardened 3-to-8 Line Decoder/Demultiplexer

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ACS138D 数据手册

ACS138MS

Die Characteristics

DIE DIMENSIONS:

PASSIVATION

Size: 2390µm x 2390µm (94 mils x 94 mils)

Thickness: 525µm ±25µm (20.6 mils ±1 mil)

Bond Pad: 110µm x 110µm (4.3 x 4.3 mils)

Type: Phosphorous Silicon Glass (PSG)

Thickness: 1.30µm ±0.15µm

SPECIAL INSTRUCTIONS:

METALLIZATION: Al

Metal 1 Thickness: 0.7µm ±0.1µm

Metal 2 Thickness: 1.0µm ±0.1µm

Bond V

First

ADDITIONAL INFORMATION:

Worst Case Density: <2.0 x 10 A/cm

Transistor Count: 220

SUBSTRATE POTENTIAL:

Unbiased Insulator

Metallization Mask Layout

ACS138MS

GND

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certiﬁcation.

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or speciﬁcations at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate

and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which

may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site http://www.intersil.com

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