Intel in Embedded and Communications: Intel.com/embedded
∆ Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families.
See http://www.intel.com/products/processor_number for details.
1
Intel® High Definition Audio requires a system with a supporting chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending on actual
implementation, controller, codec, drivers and speakers. For more information about Intel® HD audio, refer to www.intel.com.
2 Intel® Active Management Technology requires the computer system to have an Intel® AMT-enabled chipset, network hardware and software, as well as connection with a power source and a corporate network
connection. Setup requires configuration by the purchaser and may require scripting with the management console or further integration into existing security frameworks to enable certain functionality. It may also
require modifications or implementation of new business processes. For more information, see www.intel.com/technology/platform-technology/intel-amt/.
3 No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computer system with Intel® Virtualization Technology, an Intel TXT-enabled processor,
chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured launched environment (MLE). The MLE could consist of a virtual machine monitor, an OS or an application. In addition, Intel TXT requires
the system to contain a TPM v1.2, as defined by the Trusted Computing Group and specific software for some uses. For more information, see http://www.intel.com/technology/security.
4 Drivers available at: downloadcenter.intel.com (enter chipset name).
5 SFF = small form factor package.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL
DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PUR-
POSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS
ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked
“reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information
here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest
specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained
by calling 1-800-548-4725, or by visiting Intel’s Web Site www.intel.com/.
Copyright © 2010 Intel Corporation. All rights reserved. Intel, the Intel logo, Core, and Celeron are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Printed in USA
0110/KSC/OCG/XX/PDF
Please Recycle
319505-006US
5秒后页面跳转
TLP250光耦合器：资料手册参数分析
DA14580 低功耗蓝牙系统级芯片(SoC)：资料手册参数分析
INA226 高精度电流和功率监控器：资料手册参数分析
SI2302 N沟道MOSFET：资料手册参数分析
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
技术参数
数据手册
如果您发现信息不准确，
