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A8437ECGLT

更新时间： 2024-02-23 16:01:56
品牌 Logo 应用领域
急速微 - ALLEGRO /
页数 文件大小 规格书
22页 657K
描述
Analog Circuit, 1 Func, PBGA12, 1.635 X 1.205 MM, 0.50 MM HEIGHT, WLCSP-12

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A8437ECGLT 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：SON包装说明：VFBGA, BGA12,3X4,16
针数：10Reach Compliance Code：unknown
HTS代码：8542.39.00.01风险等级：5.82
模拟集成电路 - 其他类型：ANALOG CIRCUITJESD-30 代码：R-PBGA-B12
长度：1.645 mm功能数量：1
端子数量：12最高工作温度：85 °C
最低工作温度：-40 °C封装主体材料：PLASTIC/EPOXY
封装代码：VFBGA封装等效代码：BGA12,3X4,16
封装形状：RECTANGULAR封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：NOT SPECIFIED电源：3.6 V
认证状态：Not Qualified座面最大高度：0.55 mm
子类别：Power Management Circuits最大供电电流 (Isup)：0.05 mA
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：2.3 V
标称供电电压 (Vsup)：3.6 V表面贴装：YES
温度等级：INDUSTRIAL端子形式：BALL
端子节距：0.4 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：1.215 mm
Base Number Matches：1

A8437ECGLT 数据手册

 浏览型号A8437ECGLT的Datasheet PDF文件第16页浏览型号A8437ECGLT的Datasheet PDF文件第17页浏览型号A8437ECGLT的Datasheet PDF文件第18页浏览型号A8437ECGLT的Datasheet PDF文件第19页浏览型号A8437ECGLT的Datasheet PDF文件第20页浏览型号A8437ECGLT的Datasheet PDF文件第21页 
Mobile Phone Xenon Photoflash Capacitor Charger  
with IGBT Driver  
A8437  
Typical Reflow Profile per J-STD-020D  
JSTD020D-01 Table 5-2 Classification Reflow Profiles  
Profile Feature  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
Preheat/Soak  
Temperature Min (Tsmin  
Temperature Max (Tsmax  
)
100 °C  
150 °C  
150 °C  
200 °C  
)
Time (ts) from (Tsmin to Tsmax  
)
60-120 seconds  
60-120 seconds  
Ramp-up rate (TL to Tp)  
3 °C/second max.  
3 °C/second max.  
Liquidous temperature (TL)  
183 °C  
217 °C  
Time (tL) maintained above TL  
60-150 seconds  
60-150 seconds  
For users Tp must not exceed the  
For users Tp must not exceed the  
Classification temp in Table 4-1.  
Classification temp in Table 4-2.  
Peak package body temperature (Tp)  
For suppliers Tp must equal or exceed  
For suppliers Tp must equal or exceed  
the Classification temp in Table 4-1.  
the Classification temp in Table 4-2.  
Time (tp)* within 5 °C of the specified  
classification temperature (Tc), see  
Figure 5-1.  
20* seconds  
30* seconds  
Ramp-down rate (Tp to TL)  
6 °C/second max.  
6 minutes max.  
6 °C/second max.  
8 minutes max.  
Time 25 °C to peak temperature  
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.  
Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug). If  
parts are reflowed in other than the normal live-bug assembly reflow orientation (i.e., dead-bug), Tp shall be within ± 2 °C of the live-bug Tp and still  
meet the Tc requirements, otherwise, the profile shall be adjusted to achieve the latter. To accurately measure actual peak package body temperatures  
refer to JEP140 for recommended thermocouple use.  
Note 2: Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles. Actual board assembly  
profiles should be developed based on specific process needs and board designs and should not exceed the parameters in Table 5-2.  
For example, if Tc is 260 °C and time tp is 30 seconds, this means the following for the supplier and the user.  
For a supplier: The peak temperature must be at least 260 °C. The time above 255 °C must be at least 30 seconds.  
For a user: The peak temperature must not exceed 260 °C. The time above 255 °C must not exceed 30 seconds.  
Note 3: All components in the test load shall meet the classification profile requirements.  
Note 4: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020,  
JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a  
higher peak classification temperature is desired.  
Copyright ©2006-2010, Allegro MicroSystems, Inc.  
The products described here are manufactured under one or more U.S. patents or U.S. patents pending.  
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to per-  
mit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the  
information being relied upon is current.  
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the  
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.  
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use;  
nor for any infringement of patents or other rights of third parties which may result from its use.  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
21  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
1...19202122

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