POTTING BOXES
Boxes for encapsulating
electronic assemblies.
With special cost advantages
in cases of series
production because potting
electronic assemblies in
pre-assembled cases is less
complicated than casting
liquid resin-hardener
compounds in metal moulds.
Potted assemblies are
protected from shock and
temperature, humidity and
chemical influences.
Production-limited surface
quality.
VERS ION I
MATERIAL
Duroplastic.
Resistant to deformation
and extreme temperatures.
Inflexible, therefore not re-
sistant to fracture. Refer to
the material specifications
on pages 229-231.
S TANDARD
COLOUR
Black.
Part-No.
Part-No.
Lid
Outside dim. in mm
Wall-thickness Version
W (mm)
Box
A
B
C
20
20
13
15
25
15
0.8
0.8
0.8
1.0
1.0
0.8
1.0
1.0
1.0
1.0
1.0
1.3
1.3
1.6
1.4
1.4
1.5
1.5
2.0
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
A 80 20 130
A 80 25 150
A 80 25 251
A 80 30 150
A 80 40 160
A 80 40 250
A 80 40 130
A 80 40 200
A 80 45 150
A 80 45 250
A 80 50 150
A 80 50 160
A 80 50 250
A 80 50 500
A 80 70 200
A 80 70 350
A 80 90 200
A 80 10 250
A 80 10 400
–
25
25
25
20
A 81 25 250
A 81 25 250
A 81 30 200
A 81 40 130
A 81 40 130
A 81 40 400
A 81 40 400
A 81 45 300
A 81 45 300
A 81 50 130
A 81 50 500
A 81 50 500
A 81 50 500
A 81 70 500
A 81 70 500
A 81 90 600
A 81 10 500
A 81 10 100
25
30
40.6
40.4
40
13.8 16
13.7 25
40
40
30
30
13
50
50
13
20
15
25
15
15
25
40
45
45
50
50
50
50.7
70.5
70.8
90
50.7 50
50.5 20
50.8 35
60
50
20
25
40
S ERVICE- CENTRE
100
100
100
See pages 221-227.
Due to adjustment of the production there are slight tolerances possible.
210