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A2F200M3E-1FGH484 PDF预览

A2F200M3E-1FGH484

更新时间： 2024-02-15 17:57:24
品牌 Logo 应用领域
美高森美 - MICROSEMI 栅现场可编程门阵列可编程逻辑
页数 文件大小 规格书
182页 9722K
描述
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 100MHz, 4608-Cell, CMOS, PBGA484, 1 MM PITCH, HALOGEN FREE, FBGA-484

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A2F200M3E-1FGH484 技术参数

生命周期：Transferred包装说明：1 MM PITCH, HALOGEN FREE, FBGA-256
Reach Compliance Code：unknown风险等级：5.75
JESD-30 代码：S-PBGA-B256长度：17 mm
可配置逻辑块数量：1536等效关口数量：60000
端子数量：256组织：1536 CLBS, 60000 GATES
封装主体材料：PLASTIC/EPOXY封装代码：LBGA
封装形状：SQUARE封装形式：GRID ARRAY, LOW PROFILE
可编程逻辑类型：FIELD PROGRAMMABLE GATE ARRAY认证状态：Not Qualified
座面最大高度：1.7 mm最大供电电压：1.575 V
最小供电电压：1.425 V标称供电电压：1.5 V
表面贴装：YES技术：CMOS
端子形式：BALL端子节距：1 mm
端子位置：BOTTOM宽度：17 mm
Base Number Matches：1

A2F200M3E-1FGH484 数据手册

 浏览型号A2F200M3E-1FGH484的Datasheet PDF文件第3页浏览型号A2F200M3E-1FGH484的Datasheet PDF文件第4页浏览型号A2F200M3E-1FGH484的Datasheet PDF文件第5页浏览型号A2F200M3E-1FGH484的Datasheet PDF文件第7页浏览型号A2F200M3E-1FGH484的Datasheet PDF文件第8页浏览型号A2F200M3E-1FGH484的Datasheet PDF文件第9页 
SmartFusion Customizable System-on-Chip (cSoC)  
Product Ordering Codes  
_
A2F200  
M3  
F
1
FG  
G
484  
Y
I
Application (junction temperature range)  
Blank Commercial (0 to +85°C)  
I = Industrial (–40 to +100°C)  
ES = Engineering Silicon (room temperature only)  
=
Security Feature*  
Y = Device Includes License to Implement IP Based on the  
Cryptography Research, Inc. (CRI) Patent Portfolio  
Package Lead Count  
208  
256  
288  
484  
Lead-Free Packaging Options  
Blank = Standard Packaging  
G = RoHS-Compliant (green) Packaging  
H = Halogen-Free Packaging  
Package Type  
=
=
=
PQ  
CS  
FG  
Plastic Quad Flat Pack (0.5 mm pitch)  
Chip Scale Package (0.5 mm pitch)  
Fine Pitch Ball Grid Array (1.0 mm pitch)  
Speed Grade  
Blank  
= 80 MHz MSS Speed; FPGA Fabric at Standard Speed  
–1 = 100 MHz MSS Speed; FPGA Fabric 15% Faster than Standard  
eNVM Size  
=
=
=
=
=
=
=
A
B
C
D
E
F
8 Kbytes  
16 Kbytes  
32 Kbytes  
64 Kbytes  
128 Kbytes  
256 Kbytes  
512 Kbytes  
G
CPU Type  
M3 = Cortex-M3  
Part Number  
SmartFusion Devices  
A2F060 = 60,000 System Gates  
A2F200 = 200,000 System Gates  
A2F500 = 500,000 System Gates  
Note: *Most devices in the SmartFusion cSoC family can be ordered with the Y suffix. Devices with a package size greater or equal to  
5x5 mm are supported. Contact your local Microsemi SoC Products Group sales representative for more information.  
Temperature Grade Offerings  
SmartFusion cSoC  
PQ208  
A2F060  
A2F200  
C, I  
A2F500  
C, I  
–
CS288  
C, I  
C, I  
–
C, I  
C, I  
FG256  
C, I  
C, I  
FG484  
C, I  
C, I  
Notes:  
1. C = Commercial Temperature Range: 0°C to 85°C Junction  
2. I = Industrial Temperature Range: –40°C to 100°C Junction  
VI  
Revision 7  
1...3456789...182

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与A2F200M3E-1FGH484相关器件

型号 品牌 描述 获取价格 数据表
A2F200M3E-1FGH484I MICROSEMI Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 100MHz, 4608-Cell, CMOS, PBGA484,

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A2F200M3E-1FGH484Y MICROSEMI Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 100MHz, 4608-Cell, CMOS, PBGA484,

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A2F200M3E-1FGH484YI ACTEL Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 100MHz, 4608-Cell, CMOS, PBGA484,

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A2F200M3E-1FGH484YI MICROSEMI Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 100MHz, 4608-Cell, CMOS, PBGA484,

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A2F200M3E-1PQ208 MICROSEMI SmartFusion Customizable System-on-Chip (cSoC)

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A2F200M3E-1PQ208Y MICROSEMI SmartFusion Customizable System-on-Chip (cSoC)

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