是否Rohs认证: | 不符合 | 生命周期: | Active |
包装说明: | LBGA, | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.82 |
Is Samacsys: | N | JESD-30 代码: | S-PBGA-B256 |
JESD-609代码: | e0 | 长度: | 17 mm |
湿度敏感等级: | 3 | 可配置逻辑块数量: | 4608 |
等效关口数量: | 200000 | 端子数量: | 256 |
组织: | 4608 CLBS, 200000 GATES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, LOW PROFILE | 峰值回流温度(摄氏度): | 225 |
可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY | 认证状态: | Not Qualified |
座面最大高度: | 1.7 mm | 最大供电电压: | 1.575 V |
最小供电电压: | 1.425 V | 标称供电电压: | 1.5 V |
表面贴装: | YES | 技术: | CMOS |
端子面层: | TIN LEAD/TIN LEAD SILVER | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 17 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
A2F200M3A-FG256Y | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) | |
A2F200M3A-FG256Y | ACTEL |
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Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-25 | |
A2F200M3A-FG256YC | MICROSEMI |
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FPGA | |
A2F200M3A-FG256YI | MICROSEMI |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-25 | |
A2F200M3A-FG256YI | ACTEL |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-25 | |
A2F200M3A-FG288 | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) | |
A2F200M3A-FG288Y | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) | |
A2F200M3A-FG484 | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) | |
A2F200M3A-FG484 | ACTEL |
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Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA484, 1 MM PITCH, FBGA-48 | |
A2F200M3A-FG484I | ACTEL |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA484, 1 MM PITCH, FBGA-48 |