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A2F200M3A-1FGG484YI PDF预览

A2F200M3A-1FGG484YI

更新时间: 2024-02-03 09:17:01
品牌 Logo 应用领域
美高森美 - MICROSEMI 现场可编程门阵列可编程逻辑
页数 文件大小 规格书
192页 11779K
描述
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA484, 1 MM PITCH, GREEN, FBGA-484

A2F200M3A-1FGG484YI 技术参数

是否Rohs认证:符合生命周期:Active
包装说明:BGA,Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.75
Is Samacsys:NJESD-30 代码:S-PBGA-B484
JESD-609代码:e1长度:23 mm
湿度敏感等级:3可配置逻辑块数量:4608
等效关口数量:200000端子数量:484
组织:4608 CLBS, 200000 GATES封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):250
可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY认证状态:Not Qualified
座面最大高度:2.44 mm最大供电电压:1.575 V
最小供电电压:1.425 V标称供电电压:1.5 V
表面贴装:YES技术:CMOS
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40宽度:23 mm
Base Number Matches:1

A2F200M3A-1FGG484YI 数据手册

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