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A2557XLB PDF预览

A2557XLB

更新时间: 2024-01-12 05:35:37
品牌 Logo 应用领域
其他 - ETC 驱动器
页数 文件大小 规格书
12页 177K
描述
PROTECTED QUAD LOW-SIDE DRIVER WITH FAULT DETECTION & SLEEP MODE

A2557XLB 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:SOIC包装说明:LEAD FREE, MS-013AA, SOIC-16
针数:16Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.82Is Samacsys:N
内置保护:TRANSIENT; OVER CURRENT; THERMAL驱动器位数:4
接口集成电路类型:AND GATE BASED PERIPHERAL DRIVERJESD-30 代码:R-PDSO-G16
JESD-609代码:e3长度:10.3 mm
湿度敏感等级:3功能数量:4
端子数量:16最高工作温度:85 °C
最低工作温度:-20 °C输出电流流向:SINK
最大输出电流:0.3 A标称输出峰值电流:0.5 A
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP16,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
电源:5 V认证状态:Not Qualified
座面最大高度:2.65 mm子类别:Peripheral Drivers
最大供电电压:5.25 V最小供电电压:4.75 V
标称供电电压:5 V表面贴装:YES
技术:BIPOLAR温度等级:OTHER
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40断开时间:10 µs
接通时间:10 µs宽度:7.5 mm
Base Number Matches:1

A2557XLB 数据手册

 浏览型号A2557XLB的Datasheet PDF文件第4页浏览型号A2557XLB的Datasheet PDF文件第5页浏览型号A2557XLB的Datasheet PDF文件第6页浏览型号A2557XLB的Datasheet PDF文件第8页浏览型号A2557XLB的Datasheet PDF文件第9页浏览型号A2557XLB的Datasheet PDF文件第10页 
2557  
PROTECTED QUAD DRIVER  
WITH FAULT DETECTION  
& SLEEP MODE  
CIRCUIT DESCRIPTION AND APPLICATION (continued)  
IN  
NOT TO SCALE  
FAULT  
(SHORTED  
LOAD)  
WITH OUTPUT CAPACITOR  
FAULT  
(OPEN  
LOAD)  
SHORT CIRCUIT  
Dwg. WP-035  
NORMAL LOAD  
CURRENT LIMIT (12 V SUPPLY)  
CURRENT LIMIT (24 V SUPPLY)  
Under some conditions it is possible to get spurious  
glitches on the FAULT output at load turn-on and turn-off  
transitions:  
TIME  
Dwg. WP-013-1  
Light load turn-off. Under light loading conditions the  
turn-off delay (see characteristics above) of the output stage  
increases and may result in a spurious fault output of a few µs  
(the duration being proportional to the turn-off delay). As it is  
difficult to define this over all operating conditions, if a  
particular application would be sensitive to this type of glitch,  
then it is generally recommended to include a small (about  
0.01 µF) smoothing/storage capacitor at the FAULT output.  
Thermal considerations  
Device power dissipation can be calculated as:  
PD = (VO1 x IO1 x duty cycle1) + … + (VO4 x IO4 x duty cycle4)  
+ (VCC x ICC  
)
Note - ICC is also modulated by the duty cycle, but this is a  
reasonable approximation for most purposes.  
Incandescent lamp turn-on. As described above, driving an  
This can then be compared against the permitted package  
power dissipation, using:  
incandescent filament results in the driver operating in current  
limit for a period after turn-on. During this period a “fault”  
condition will be indicated (over current). As discussed above  
this period can be 10s of ms. To avoid this indication, the  
capacitor on the FAULT output would need to be increased to  
provide an appropriate time constant. Alternatively, in a  
microcontroller-based system, the code could be written to  
ignore the FAULT condition for an appropriate period after  
lamp turn on.  
Permitted PD = (150 – TA)/RθJA  
where RθJA is given as:  
28-lead PLCC (part number suffix ‘–EB’) = 36°C/W  
16-pin PDIP (part number suffix ‘–B’) =  
16-lead SOIC (part number suffix ‘–LB’) = 60°C/W  
43°C/W  
The thermal resistance from junction to power tab (RθJT) is  
about 6°C/W for the three package types, therefore the power  
dissipation can be improved by 20% to 30% by adding an area  
of printed wiring board copper (typically 6 to 18 square  
centimetres) connected to the power-tab GROUND terminals of  
the device.  
Correct FAULT operation cannot be guaranteed with an  
unconnected output — unused outputs should not be turned on,  
or unused outputs should be pulled high to >2.5 V, and/or  
associated inputs tied low.  
www.allegromicro.com  
7

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