Datasheet > A1101LLHLX-T

A1101LLHLX-T

更新时间： 2022-02-26 12:01:08

品牌	Logo	应用领域
急速微 - ALLEGRO		/
页数	文件大小	规格书
13页	642K
描述
Continuous-Time Switch Family

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数据手册

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A1101LLHLX-T 数据手册

A1101, A1102, A1103,

A1104, and A1106

Continuous-Time Switch Family

THERMAL CHARACTERISTICS: may require derating at maximum conditions; see application information

Characteristic

Symbol

Test Conditions

Value Units

Package LH, 1-layer PCB with copper limited to solder pads

228

110

165

ºC/W

Package LH, 2-layer PCB with 0.463 in. of copper area each side

Package Thermal Resistance

R_θJA

connected by thermal vias

Package UA, 1-layer PCB with copper limited to solder pads

Power Derating Curve

T_J(max)= 165ºC; I_CC= I_CC(max)

CC(max)

Package LH, 2-layer PCB

(R_θJA= 110 ºC/W)

Package UA, 1-layer PCB

(R_θJA= 165 ºC/W)

Package LH, 1-layer PCB

(R_θJA= 228 ºC/W)

CC(min)

100

120

140

160

180

Power Dissipation versus Ambient Temperature

1900

1800

1700

1600

1500

1400

1300

1200

1100

1000

900

800

700

600

500

400

300

200

100

120

140

160

180

Temperature (°C)

Allegro MicroSystems, LLC

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

1 2 3 456 7 8...13

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