TM
1
V•I Chip – BCM
Bus Converter Module
B048K120T20
Vin = 42 - 53 V
Vout = 10.5 - 13.25 V
• 48V to 12V V•I Chip Converter
• 200 Watt (300 Watt for 1 mS)
• High density – up to 800 W/in3
• Small footprint – 200 W/in2
• Low weight – 0.4 oz (12 g)
• Pick & Place / SMD
• >96% efficiency
Iout = 17.0 A
1
K = /
4
• 125°C operation
Rout = 25 mΩ max
• 1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
• V•I ChipBGA package
©
Actual size
Product Description
Absolute Maximum Ratings
The V•I Chip Bus Converter Module
(BCM) is a high efficiency (>96%),
narrow input range Voltage
Transformation Module (VTM) operating
from a pre-regulated 48 Vdc primary bus
to deliver an isolated 12 V secondary for
Intermediate Bus Architecture
applications. The BCM may be used to
power non-isolated POL converters or as
an independent 12 V source. Due to the
fast response time and low noise of the
BCM, the need for limited life aluminum
electrolytic or tantalum capacitors at the
input of POL converters is reduced—or
eliminated—resulting in savings of board
area, materials and total system cost.
Parameter
Values
Unit
Notes
+In to -In
-1.0 to 60.0
100
Vdc
Vdc
Vdc
Vdc
mA
Vdc
Vdc
°C
+In to -In
For 100 ms
PC to -In
-0.3 to 7.0
-0.3 to 7.0
500
TM to -In
SG to -In
+Out to -Out
-0.5 to 15.0
1500
Isolation voltage
Operating junction temperature
Output current
Input to Output
See note 2
Continuous
For 1 ms
-40 to 125
17.0
A
Peak output current
Case temperature during reflow
Storage temperature
Output power
25
A
208
°C
-40 to 150
200
°C
W
Continuous
For 1 ms
The BCM achieves a power density of
800 W/in3 and may be surface mounted
with a profile as low as 0.16" (4mm) over
the PCB. Its V•I Chip power BGA package
is compatible with on-board or in-board
surface mounting. The V•I Chip package
provides flexible thermal management
through its low Junction-to-Case and
Junction-to-BGA thermal resistance.
Owing to its high conversion efficiency
and safe operating temperature range, the
BCM does not require a discrete heat sink
in typical applications. It is also
Peak output power
300
W
Thermal Resistance
Symbol
RθJC
Parameter
Typ
1.1
2.1
6.5
5.0
Max
Units
°C/W
°C/W
°C/W
°C/W
Junction-to-case
Junction-to-BGA
Junction-to-ambient3
Junction-to-ambient4
1.5
2.5
7.2
5.5
RθJB
RθJA
RθJA
Notes
1. For complete product matrix see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature. This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
compatible with heat sink options,
assuring low junction temperatures and
long life in the harshest environments.
3. B048K120T20 surface mounted in-board to a 2" x 2" FR4 board, 8 oz Cu total, 300 LFM.
4. B048L120T20 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
Vicor Corporation
Tel: 800-735-6200
V•I Chip Bus Converter
B048K120T20
Rev. 1.7
Page 1 of 16
45
vicorpower.com