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8537AY-01 PDF预览

8537AY-01

更新时间: 2024-02-03 04:55:36
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艾迪悌 - IDT /
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8537AY-01 数据手册

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ICS8537-01  
HEX, LOW SKEW, 1-TO-2  
DIFFERENTIAL-TO-3.3V/2.5V LVPECL CLOCK BUFFER  
POWER CONSIDERATIONS  
This section provides information on power dissipation and junction temperature for the ICS8537-01.  
Equations and example calculations are also provided.  
1. Power Dissipation.  
The total power dissipation for the ICS8537-01 is the sum of the core power plus the power dissipated in the load(s).  
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.  
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.  
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 130mA = 450.5mW  
Power (outputs)MAX = 30mW/Loaded Output pair  
If all outputs are loaded, the total power is 12 * 30mW = 360mW  
Total Power_MAX (3.465V, with all outputs switching) = 450.5mW + 360mW = 810.5mW  
2. Junction Temperature.  
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the  
device. The maximum recommended junction temperature for the devices is 125°C.  
The equation for Tj is as follows: Tj = θJA * Pd_total + TA  
Tj = JunctionTemperature  
θJA = junction-to-ambient thermal resistance  
Pd_total =Total device power dissipation (example calculation is in section 1 above)  
TA = AmbientTemperature  
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a  
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 6 below.  
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:  
85°C + 0.811W * 42.1°C/W = 119.1°C. This is well below the limit of 125°C  
This calculation is only an example.Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,  
and the type of board (single layer or multi-layer).  
TABLE 6. THERMAL RESISTANCE θJA FOR 48-PIN LQFP, FORCED CONVECTION  
θJA byVelocity (Linear Feet per Minute)  
0
200  
55.9°C/W  
42.1°C/W  
500  
50.1°C/W  
39.4°C/W  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
67.8°C/W  
47.9°C/W  
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.  
8537AY-01  
www.idt.com  
REV.B NOVEMBER 22, 2010  
8

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