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80-0276-F PDF预览

80-0276-F

更新时间: 2022-12-16 17:50:07
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System Level ESD Mitigation

80-0276-F 数据手册

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System Level ESD Mitigation  
Design Note  
7. (Recommended) Tightly twist power wires and their returns together. The main power source in the system  
is often a prime target for inductive coupling from ESD. Wires from a battery box are an example of this.  
8. (Desirable) Try to use the following for all signals: twisted pair cable, coaxial cable or flat cable instead of  
single wires. Put shrink tubing on wires if extra shielding is required.  
9. (Desirable) Choose ESD safe components, like thick-film and carbon composition resistors instead of thin-  
film resistors, if practical  
10. (Desirable) Beware of substitute and second-source components that may be functionally equivalent, but  
lack the ESD-immunity of the preferred components.  
D. Making Your Enclosure More Resistant To ESD:  
For enclosure design, the overall goal is to keep all ESD outside the enclosure. The best way to do this is to use  
an electrically nonconductive (typically plastic) enclosure.  
Plastic and other nonconductive enclosures, air space, and insulation can prevent ESD arcs from penetrating  
inside the system (direct ESD). However, they provide no protection against ESD arcs outside the enclosure  
(indirect ESD). To protect against these arcs, ensure greater than or equal to 20 mm path length between the  
electronics and:  
1. (Recommended) Any points that the user can touch, including seams, ventilation openings and mounting  
holes. (ESD arcs can travel farther over the surface of a dielectric than they can through open air.)  
2. (Recommended) Any ungrounded metal that the user can touch, including fasteners, switches, controls, and  
indicators.  
If practical and system cost allows, it's better to design with provisions for adding shields made of one of the  
following materials:  
1. (Desirable) Conductive filler in the plastic.  
2. (Desirable) Silver, copper or nickel paint.  
3. (Desirable) Mylar/copper or Mylar/aluminum laminates.  
4. (Desirable) Zinc arc spray.  
5. (Desirable) Thermoformed metal mesh with bonded junctions.  
6. (Desirable) Sheet metal.  
7. (Desirable) Vacuum metallizing.  
Optimal shielding is less than or equal to 1 ohm/square resistance. Joints and edge treatment are critical, as are  
arrangements for connecting bonding jumpers/wires.  
4
P/N 80-0276-F  
© 2006 Sensory Inc.  

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