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8-141-34W PDF预览

8-141-34W

更新时间: 2022-02-26 11:26:02
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
282页 5761K
描述
High-Speed Interconnect Technology

8-141-34W 数据手册

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®
CIN::APSE  
High-Speed Interconnect Technology  
THE BUTTON CONTACT  
The unique construction of the CIN::APSE contact  
provides superior mechanical and electrical performance.  
It is constructed of randomly wound molybdenum wire that  
is formed into a cyclindrical shape. Standard CIN::APSE  
contact diameters are 0.020" and 0.040".  
Mechanical  
• Small form factor (0.020" diameter by 0.32" min. high)  
• Low compression force (approx. 2.5 oz. min. per contact)  
• Multiple beam structures  
• Several points of contact per button  
• Extremely lightweight  
Typical CIN::APSE Applications  
• Natural wiping action  
• LGA package I/O to PC board (IC packages,  
multi-chip modules)  
Electrical  
• PC board to PC board (parallel processors,  
enhancement/mezzanine cards)  
• Flex circuit to PC board (rigid flex, harnessing)  
• Short signal path  
• Very low inductance and resistance  
• Signal integrity tested in the GHz range  
• Flex circuit to ceramic (chip to harness)  
CIN::APSE APPLIED  
The basic button contact  
configuration consists of a single  
button installed in our patented  
“hourglass” design.  
Step 2:  
Add Z-Axis compression  
and secure.  
Step 1:  
Using alignment features,  
position the CIN::APSE  
connector between a LGA chip  
package and PCB or two PCBs  
that have matching footprints.  
The hourglass cavity retains the  
CIN::APSE contact securely.  
Typically 0.003" protrudes from the  
top and the bottom of the insulator.  
Call Toll Free: 1 (800) 323-9612  
1-2  

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