Datasheet > 78061-0052

78061-0052

更新时间： 2024-01-07 13:10:12

品牌	Logo	应用领域
莫仕 - MOLEX		/
页数	文件大小	规格书
7页	365K
描述
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38μm (15μ) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins

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数据手册

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78061-0052 数据手册

This document was generated on 04/13/2010

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

Part Number:

Status:

0780610052

Active

Description:

1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38µm

(15µ") Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins, with Black

Latches, 3.18mm (.125") Solder Tail Length, Lead-free

Documents:

3D Model

Drawing (PDF)

Product Specification PS-78061-001 (PDF)

RoHS Certificate of Compliance (PDF)

Series

image - Reference only

China RoHS

Agency Certification

CSA

LR 19980

E29179

EU RoHS

ELV and RoHS

Compliant

REACH SVHC

Contains SVHC: No

Halogen-Free

Status

Not Halogen-Free

Need more information on product

environmental compliance?

General

Product Family

Series

Memory Module Sockets

78061

<LI>Latches in Black Color <LI>Solder Tail Length at

3.18mm (.125")

Memory Module

MO-256

Comments

Component Type

JEDEC Outline

Product Name

FB DIMM

Email productcompliance@molex.com

For a multiple part number RoHS Certificate of

Compliance, click here

Physical

Circuits (Loaded)

240

Black

Color - Resin

Durability (mating cycles max)

Entry Angle

Flammability

Please visit the Contact Us section for any

non-product compliance questions.

Vertical (Top Entry)

94V-0

Keying to Mating Part

Material - Metal

Yes

Brass, Phosphor Bronze

Material - Plating Mating

Material - Plating Termination

Material - Resin

Gold

Tin

Search Parts in this Series

78061Series

High Temperature Thermoplastic

PC Tail Length (in)

PC Tail Length (mm)

PCB Locator

0.125 In

3.18 mm

Yes

Mates With

JEDEC MO-256 modules

PCB Retention

Yes

PCB Thickness Recommended (in)

PCB Thickness Recommended (mm)

Packaging Type

0.093 In

2.40 mm

Tray

Pitch - Mating Interface (in)

Pitch - Mating Interface (mm)

Plating min: Mating (µin)

Plating min: Mating (µm)

Temperature Range - Operating

Termination Interface: Style

0.039 In

1.00 mm

0.38

-55°C to +85°C

Through Hole

Electrical

Current - Maximum per Contact

Voltage - Maximum

Voltage Key

30V

1.8V, Center

Solder Process Data

Duration at Max. Process Temperature (seconds)

Lead-free Process Capability

SMC & Wave Capable (TH only)

Max. Cycles at Max. Process Temperature

12 3 4 5 6 7

中文翻译

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与78061-0052相关器件

型号	品牌	获取价格	描述	数据表
78061-0061	MOLEX	获取价格	1.00mm (.039) Pitch Fully Buffered DIMM Socke
78061-0062	MOLEX	获取价格	1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76u (30u") Gold
78064	ALPHAWIRE	获取价格	Wire And Cable
78064-002	AMPHENOL	获取价格	Telecom and Datacom Connector, 12 Contact(s), Male, Straight, Solder Terminal
78064-002LF	AMPHENOL	获取价格	Telecom and Datacom Connector, 12 Contact(s), Male, Straight, Solder Terminal, Locking, LE
78064-003	AMPHENOL	获取价格	Telecom and Datacom Connector, 12 Contact(s), Male, Straight, Solder Terminal
78064-004	AMPHENOL	获取价格	Telecom and Datacom Connector, 12 Contact(s), Male, Straight, Solder Terminal
78064-005	AMPHENOL	获取价格	Telecom and Datacom Connector, 12 Contact(s), Male, Straight, Solder Terminal
78064-005LF	AMPHENOL	获取价格	Telecom and Datacom Connector, 12 Contact(s), Male, Straight, Solder Terminal, LEAD FREE
78064-007LF	AMPHENOL	获取价格	Telecom and Datacom Connector, 12 Contact(s), Male, Straight, Solder Terminal, Locking, LE

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