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73S8014BN-ILR/F PDF预览

73S8014BN-ILR/F

更新时间: 2024-02-16 19:10:08
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
29页 542K
描述
Smart Card Interface

73S8014BN-ILR/F 技术参数

生命周期:Transferred包装说明:ROHS COMPLIANT, SOP-20
Reach Compliance Code:unknown风险等级:5.59
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:R-PDSO-G20
长度:12.76 mm功能数量:1
端子数量:20最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE认证状态:Not Qualified
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):2.7 V
表面贴装:YES温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL宽度:7.51 mm
Base Number Matches:1

73S8014BN-ILR/F 数据手册

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73S8014BN Data Sheet  
DS_8014BN_057  
Figures  
Figure 1: 73S8014BN Block Diagram ....................................................................................................................2  
Figure 2: 73S8014BN 20-SO Pinout ......................................................................................................................5  
Figure 3: 73S8014BN—Typical Application Schematic ........................................................................................14  
Figure 4: Power-Down Mode and PRES Debounce .............................................................................................16  
Figure 5: CLKDIV Usage .....................................................................................................................................17  
Figure 6: Activation Sequence—RSTIN Low When CMDVCC Goes Low .............................................................18  
Figure 7: Activation Sequence—RSTIN High When CMDVCC Goes Low ............................................................19  
Figure 8: Deactivation Sequence.........................................................................................................................19  
Figure 9: Timing Diagram—Management of the Interrupt Line OFF......................................................................20  
Figure 10: I/O and I/OUC State Diagram..............................................................................................................21  
Figure 11: Timing Diagram—I/O to I/OUC Delays................................................................................................21  
Figure 12: Open-Drain Type—OFF......................................................................................................................22  
Figure 13: Power Input/Output Circuit—VDD, VPC, VCC ..........................................................................................22  
Figure 14: Smart Card CLK Driver Circuit ............................................................................................................23  
Figure 15: Smart Card RST Driver Circuit............................................................................................................23  
Figure 16: Smart Card I/O, C4, and C8 Interface Circuit.......................................................................................24  
Figure 17: Smart Card I/OUC Interface Circuit.....................................................................................................24  
Figure 18: General Input Circuit...........................................................................................................................25  
Figure 19: Oscillator Circuit..................................................................................................................................25  
Figure 20: CLKDIV ..............................................................................................................................................26  
Figure 21: Mechanical Drawing 20-Pin SO Package............................................................................................27  
Tables  
Table 1: 73S8014BN 20-Pin SO Pin Definitions.....................................................................................................6  
Table 2: Absolute Maximum Device Ratings..........................................................................................................8  
Table 3: Recommended Operating Conditions.......................................................................................................8  
Table 4: DC Smart Card Interface Requirements...................................................................................................9  
Table 5: Digital Signals Characteristics................................................................................................................11  
Table 6: DC Characteristics.................................................................................................................................12  
Table 7: Voltage and Current Fault-Detection Circuits..........................................................................................12  
Table 8: VCC Voltage Logic Table.........................................................................................................................15  
Table 9: Order Numbers and Packaging Marks....................................................................................................28  
4
Rev. 2  

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