是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
包装说明: | HVQCCN, | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.65 |
Samacsys Confidence: | Samacsys Status: | Released | |
Schematic Symbol: | https://componentsearchengine.com/symbol.php?partID=599365 | PCB Footprint: | https://componentsearchengine.com/footprint.php?partID=599365 |
Samacsys PartID: | 599365 | Samacsys Image: | https://componentsearchengine.com/Images/9/73S8010R-IMR/F1.jpg |
Samacsys Thumbnail Image: | https://componentsearchengine.com/Thumbnails/1/73S8010R-IMR/F1.jpg | Samacsys Pin Count: | 33 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Other |
Samacsys Footprint Name: | QFN50P500X500X90-33N | Samacsys Released Date: | 2017-01-11 21:24:41 |
Is Samacsys: | N | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | S-XQCC-N32 | 长度: | 5 mm |
功能数量: | 1 | 端子数量: | 32 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | UNSPECIFIED | 封装代码: | HVQCCN |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 座面最大高度: | 0.9 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.7 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 5 mm | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
73S8010R-IMR/F2 | MAXIM | Analog Circuit, 1 Func, 5 X 5 MM, 0.80 MM HEIGHT, LEAD FREE, QFN-32 |
获取价格 |
|
73S8014BN | MAXIM | Smart Card Interface |
获取价格 |
|
73S8014BN-IL/F | MAXIM | Smart Card Interface |
获取价格 |
|
73S8014BN-ILR/F | MAXIM | Smart Card Interface |
获取价格 |
|
73S8014R | TERIDIAN | Smart Card Interface |
获取价格 |
|
73S8014R-IL/F | TERIDIAN | Smart Card Interface |
获取价格 |