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71M6533H PDF预览

71M6533H

更新时间: 2024-01-02 10:52:30
品牌 Logo 应用领域
TERIDIAN /
页数 文件大小 规格书
124页 1997K
描述
Energy Meter IC

71M6533H 技术参数

生命周期:Transferred包装说明:LEAD FREE, LQFP-100
Reach Compliance Code:unknown风险等级:5.57
Is Samacsys:N模拟集成电路 - 其他类型:ANALOG CIRCUIT
JESD-30 代码:S-PQFP-G100长度:14 mm
功能数量:1端子数量:100
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:LFQFP
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE, FINE PITCH
认证状态:Not Qualified座面最大高度:1.6 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
宽度:14 mmBase Number Matches:1

71M6533H 数据手册

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FDS_6533_6534_004  
71M6533/71M6534 Data Sheet  
Figures  
Figure 1: IC Functional Block Diagram .........................................................................................................8  
Figure 2: General Topology of a Chopped Amplifier ..................................................................................12  
Figure 3: CROSS Signal with CHOP_E = 00..............................................................................................13  
Figure 4: AFE Block Diagram .....................................................................................................................14  
Figure 5: Samples from Multiplexer Cycle ..................................................................................................17  
Figure 6: Accumulation Interval ..................................................................................................................17  
Figure 7: Interrupt Structure........................................................................................................................36  
Figure 8: Optical Interface...........................................................................................................................42  
Figure 9: Connecting an External Load to DIO Pins...................................................................................45  
Figure 10: 3-wire Interface. Write Command, HiZ=0. ................................................................................48  
Figure 11: 3-wire Interface. Write Command, HiZ=1 .................................................................................48  
Figure 12: 3-wire Interface. Read Command.............................................................................................48  
Figure 13: 3-Wire Interface. Write Command when CNT=0......................................................................49  
Figure 14: 3-wire Interface. Write Command when HiZ=1 and WFR=1....................................................49  
Figure 15: SPI Slave Port: Typical Read and Write operations..................................................................50  
Figure 16: Functions defined by V1 ............................................................................................................51  
Figure 17: Voltage, Current, Momentary and Accumulated Energy...........................................................53  
Figure 18: Timing Relationship between ADC MUX and Compute Engine................................................54  
Figure 19: RTM Output Format...................................................................................................................54  
Figure 20: Operation Modes State Diagram ...............................................................................................55  
Figure 21: Functional Blocks in BROWNOUT Mode ..................................................................................58  
Figure 22: Functional Blocks in LCD Mode.................................................................................................59  
Figure 23: Functional Blocks in SLEEP Mode............................................................................................60  
Figure 24: Transition from BROWNOUT to MISSION Mode when System Power Returns ......................61  
Figure 25: Power-Up Timing with V3P3SYS and VBAT tied together........................................................61  
Figure 26: Power-Up Timing with VBAT only..............................................................................................62  
Figure 27: Wake Up Timing ........................................................................................................................63  
Figure 28: MPU/CE Data Flow....................................................................................................................64  
Figure 29: MPU/CE Communication...........................................................................................................64  
Figure 30: Resistive Voltage Divider...........................................................................................................65  
Figure 31: CT with Single Ended (Left) and Differential Input (Right) Connection .....................................65  
Figure 32: Resistive Shunt (Left), Rogowski Sensor (Right) ......................................................................65  
Figure 33: Connecting LCDs.......................................................................................................................68  
Figure 34: I2C EEPROM Connection ..........................................................................................................68  
Figure 35: Three-Wire EEPROM Connection.............................................................................................69  
Figure 36: Connections for UART0.............................................................................................................69  
Figure 37: Connection for Optical Components..........................................................................................70  
Figure 38: Voltage Divider for V1................................................................................................................71  
Figure 39: External Components for the RESET Pin: Push-Button (Left), Production Circuit (Right)........71  
Figure 40: External Components for the Emulator Interface ......................................................................72  
Figure 41: Connecting a Battery .................................................................................................................72  
Figure 42: CE Data Flow: Multiplexer and ADC........................................................................................100  
Figure 43: CE Data Flow: Scaling, Gain Control, Intermediate Variables ................................................100  
Figure 44: CE Data Flow: Squaring and Summation Stages....................................................................101  
Figure 45: SPI Slave Port (MISSION Mode) Timing.................................................................................111  
Figure 46: Wh Accuracy (0.1 A - 200 A, 240 V, Room Temperature) at Various Frequencies (Differential  
Mode, CTs) ........................................................................................................................................112  
Figure 47: Typical Wh Accuracy (0.02 A - 200 A, 240 V, Room Temperature), Various Load Angles  
(Differential Mode, CTs).....................................................................................................................112  
Figure 48: 71M6533/6533H 100-pin LQFP Package Outline ...................................................................113  
Figure 49: 71M6534/6534H 120-pin LQFP Package Outline ...................................................................114  
Figure 50: Pinout for 71M6533/71M6533H LQFP-100 Package..............................................................115  
Figure 51: Pinout for 71M6534/71M6534H LQFP-120 Package..............................................................116  
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