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7143SA45FB PDF预览

7143SA45FB

更新时间: 2024-01-09 22:17:53
品牌 Logo 应用领域
艾迪悌 - IDT 静态存储器内存集成电路
页数 文件大小 规格书
16页 137K
描述
Dual-Port SRAM, 2KX16, 45ns, CMOS, CQFP68, 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, FP-68

7143SA45FB 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Obsolete零件包装代码:QFP
包装说明:1.180 X 1.180 INCH, 0.160 INCH HEIGHT, FP-68针数:68
Reach Compliance Code:not_compliantECCN代码:3A001
HTS代码:8542.32.00.41风险等级:5.47
Is Samacsys:N最长访问时间:45 ns
I/O 类型:COMMONJESD-30 代码:S-CQFP-F68
JESD-609代码:e0长度:24.0792 mm
内存密度:32768 bit内存集成电路类型:DUAL-PORT SRAM
内存宽度:16功能数量:1
端口数量:2端子数量:68
字数:2048 words字数代码:2000
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-55 °C组织:2KX16
输出特性:3-STATE封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:QFF封装等效代码:QFL68,.95SQ
封装形状:SQUARE封装形式:FLATPACK
并行/串行:PARALLEL峰值回流温度(摄氏度):225
电源:5 V认证状态:Not Qualified
筛选级别:MIL-PRF-38535座面最大高度:3.683 mm
最大待机电流:0.004 A最小待机电流:2 V
子类别:SRAMs最大压摆率:0.33 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子面层:Tin/Lead (Sn/Pb)端子形式:FLAT
端子节距:1.27 mm端子位置:QUAD
处于峰值回流温度下的最长时间:20宽度:24.0792 mm
Base Number Matches:1

7143SA45FB 数据手册

 浏览型号7143SA45FB的Datasheet PDF文件第1页浏览型号7143SA45FB的Datasheet PDF文件第3页浏览型号7143SA45FB的Datasheet PDF文件第4页浏览型号7143SA45FB的Datasheet PDF文件第5页浏览型号7143SA45FB的Datasheet PDF文件第6页浏览型号7143SA45FB的Datasheet PDF文件第7页 
IDT7133SA/LA,IDT7143SA/LA  
High-Speed 2K x 16 Dual-Port RAM  
Military, Industrial and Commercial Temperature Ranges  
RAM or as a MASTER” Dual-Port RAM together with the IDT7143 port to enter a very low standby power mode.  
SLAVE”Dual-Portin32-bit-or-morewordwidthsystems.UsingtheIDT  
FabricatedusingIDT’s CMOShigh-performance technology, these  
MASTER/SLAVEDual-PortRAMapproachin32-bit-or-widermemory devices typically operate on only 1,150mW of power. Low-power (LA)  
systemapplicationsresultsinfull-speed,error-freeoperationwithoutthe versions offer battery backup data retention capability, with each port  
needforadditionaldiscretelogic.  
typicallyconsuming200µWfora2Vbattery.  
Both devices provide two independent ports with separate control,  
The IDT7133/7143 devices have identical pinouts. Each is packed  
address, and I/O pins that permit independent, asynchronous access in a 68-pin ceramic PGA, 68-pin flatpack, 68-pin PLCC and 100-pin  
for reads or writes to any location in memory. An automatic power TQFP. Military grade product is manufactured in compliance with the  
down feature, controlled by CE, permits the on-chip circuitry of each latest revision of MIL-PRF-38535 QML, making it ideally suited to  
military temperature applications demanding the highest level of  
performance and reliability.  
Pin Configurations(1,2,3)  
INDEX  
9
8
7
6
5
4
3
2
68 67 66 65 64 63 62 61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
I/O9L  
I/O10L  
I/O11L  
I/O12L  
I/O13L  
I/O14L  
I/O15L  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
A
A
A
A
A
A
A
6L  
5L  
4L  
3L  
2L  
1L  
0L  
1
IDT7133/43  
J68-1 / F68-1(4)  
V
CC(1)  
BUSY  
CE  
CE  
BUSY  
L
(2)  
GND  
I/O0R  
I/O1R  
I/O2R  
I/O3R  
I/O4R  
I/O5R  
I/O6R  
I/O7R  
L
68-Pin PLCC/Flatpack  
(5)  
R
Top View  
R
A0R  
A1R  
A2R  
A3R  
A4R  
A5R  
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43  
,
2746 drw 02  
Index  
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76  
N/C  
N/C  
N/C  
1
N/C  
N/C  
N/C  
N/C  
75  
2
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
3
N/C  
4
A
A
A
A
A
A
5L  
4L  
3L  
2L  
1L  
0L  
I/O10L  
I/O11L  
I/O12L  
I/O13L  
GND  
5
6
7
8
9
IDT7133/43PF  
PN100-1  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
I/O14L  
I/O15L  
(4)  
N/C  
BUSY  
GND  
L
VCC  
100-Pin TQFP  
GND  
I/O0R  
I/O1R  
I/O2R  
(5)  
Top View  
N/C  
BUSY  
N/C  
R
A
A
A
A
A
0R  
1R  
2R  
3R  
4R  
VCC  
I/O3R  
I/O4R  
I/O5R  
I/O6R  
N/C  
N/C  
N/C  
N/C  
NOTES:  
1. Both VCC pins must be connected to the power supply to ensure reliable  
operation.  
2. Both GND pins must be connected to the ground supply to ensure reliable  
operation.  
N/C  
N/C  
N/C  
N/C  
3. J68-Package body is approximately 0.95 in x 0.95 in x 0.17 in.  
F68-Package body is approximately 1.18 in x 1.18 in x 0.16 in.  
PN100-Package body is approximately 14mm x 14mm x 1.4mm.  
4. This package code is used to reference the package diagram.  
5. This text does not indicate orientation of the actual part-marking.  
,
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50  
2746 drw 03  
6.42  
2

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