Datasheet > 6P25C

6P25C

更新时间： 2024-01-04 20:11:08

品牌	Logo	应用领域
其他 - ETC		模拟IC
页数	文件大小	规格书
4页	168K
描述
Analog IC

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中文翻译

获取价格

技术参数
数据手册

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6P25C 技术参数

生命周期：	Obsolete	包装说明：	,
Reach Compliance Code：	unknown	风险等级：	5.82
Is Samacsys：	N	模拟集成电路 - 其他类型：	DC-DC BOOSTER MODULE
Base Number Matches：	1

6P25C 数据手册

Mechanical Outline

TOLERANCES

+.008” for 3 place decimals

+ .02” for 2 place decimals

+ .002” for pin diameter

Pin Out

System Interconnection Guidelines

1. Each SIP must have input, ground and output pins

sunk into common input ground and output planes in

the host PC board.

Function

Description

Output Voltage

Output Adjust*

Ground

InterModule 1

Ground

InterModule 2

5V Input Voltage

2. Two additional common signal traces are required to

interconnect INT1 and INT2 pins. These traces must

be a least 0.06” wide and make a straight connection

among the modules.

3. Power Booster SIP must be adjacent to the Control

SIP located in the center of the layout, as shown in

the Typical Example figure. Recommended distance

between SIP pin centers is 0.5”.

TRIM

GND

INTI

Gnd

INT2

* not connected on Boosters

Standard Options are shown, consult factory for other available options.

The information provided herein is believed to be reliable; however, C&D TECHNOLOGIES assumes no responsibility for inaccuracies or omissions. C&D TECHNOLOGIES assumes

no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No

patent rights or licenses to any of the circuits described herein are implied or granted to any third party. C&D TECHNOLOGIES does not authorize or warrant any C&D TECHNOLOGIES

product for use in life support devices/systems or in aircraft control applications.

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