Mechanical Outline
TOLERANCES
+.008” for 3 place decimals
+ .02” for 2 place decimals
+ .002” for pin diameter
Pin Out
System Interconnection Guidelines
1. Each SIP must have input, ground and output pins
sunk into common input ground and output planes in
the host PC board.
Pin
1
2
3
4
5
6
7
8
Function
Vo
Description
Output Voltage
Output Voltage
Output Adjust*
Ground
InterModule 1
Ground
InterModule 2
5V Input Voltage
5V Input Voltage
Vo
2. Two additional common signal traces are required to
interconnect INT1 and INT2 pins. These traces must
be a least 0.06” wide and make a straight connection
among the modules.
3. Power Booster SIP must be adjacent to the Control
SIP located in the center of the layout, as shown in
the Typical Example figure. Recommended distance
between SIP pin centers is 0.5”.
TRIM
GND
INTI
Gnd
INT2
Vi
9
Vi
* not connected on Boosters
Standard Options are shown, consult factory for other available options.
The information provided herein is believed to be reliable; however, C&D TECHNOLOGIES assumes no responsibility for inaccuracies or omissions. C&D TECHNOLOGIES assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No
patent rights or licenses to any of the circuits described herein are implied or granted to any third party. C&D TECHNOLOGIES does not authorize or warrant any C&D TECHNOLOGIES
product for use in life support devices/systems or in aircraft control applications.
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