Datasheet > 6DFN12A thru 6DFN51A

6DFN12A thru 6DFN51A

更新时间： 2023-12-06 20:07:39

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Surface Mount Transzorb? Transient Voltage Suppressors

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6DFN12A thru 6DFN51A 数据手册

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6DFN12A thru 6DFN51A

Vishay General Semiconductor

www.vishay.com

ELECTRICAL CHARACTERISTICS (T_A= 25 °C, unless otherwise noted)

MAXIMUM

TYPICAL

TEMP.

STAND-

OFF

REVERSE

LEAKAGE

AT V_WM

T_J= 150 °C

I_D

TEST

CURRENT

I_T

REVERSE

LEAKAGE

AT V_WM

I_R

PEAK PULSE CLAMPING

BREAKDOWN

VOLTAGE

V_BR⁽¹⁾AT I_T

(V)

DEVICE

MARKING

CODE

SURGE

VOLTAGE COEFFICIENT

DEVICE

TYPE

VOLTAGE

V_WM

(3)

CURRENT

AT I_PPM

V_C

(V)

OF V_BR

(2)

(mA)

I_PPM

(A)

αT

(%/°C)

(V)

(μA)

MIN. NOM. MAX.

11.4 12.0 12.6

12.4 13.0 13.7

14.3 15.0 15.8

15.2 16.0 16.8

17.1 18.0 18.9

19.0 20.0 21.0

20.9 22.0 23.1

22.8 24.0 25.2

25.7 27.0 28.4

28.5 30.0 31.5

31.4 33.0 34.7

34.2 36.0 37.8

37.1 39.0 41.0

40.9 43.0 45.2

44.7 47.0 49.4

48.5 51.0 53.6

6DFN12A

6DFN13A

6DFN15A

6DFN16A

6DFN18A

6DFN20A

6DFN22A

6DFN24A

6DFN27A

6DFN30A

6DFN33A

6DFN36A

6DFN39A

6DFN43A

6DFN47A

6DFN51A

6AA

6AB

6AC

6AD

6AE

6AF

6AG

6AH

6AJ

6AK

6AL

6AM

6AN

6AP

6AQ

6AR

1.0

10.2

11.1

12.8

13.6

15.3

17.1

18.8

20.5

23.1

25.6

28.2

30.8

33.3

36.8

40.2

43.6

2.0

1.0

6.0

5.0

10.0

35.9

33.0

28.3

26.7

23.5

21.7

19.6

18.1

16.0

14.5

13.1

12.0

11.1

10.1

9.3

16.7

18.2

21.2

22.5

25.5

27.7

30.6

33.2

37.5

41.4

45.7

49.9

53.9

59.3

64.8

70.1

0.070

0.072

0.076

0.078

0.080

0.082

0.084

0.085

0.087

0.088

0.089

0.090

0.091

0.092

0.093

8.6

Notes

(1)

Pulse test: t_p≤ 50 ms

Surge current waveform per fig. 3 and derated per fig. 2

To calculate V_BRvs. junction temperature, use the following formula: V_BRat T_J= V_BRat 25 °C x (1 + αT x (T_J- 25))

All terms and symbols are consistent with ANSI/IEEE C62.35

(2)

(3)

(4)

THERMAL CHARACTERISTICS (T_A= 25 °C unless otherwise noted)

PARAMETER

SYMBOL

TYP.

140

MAX.

175

UNIT

°C/W

(1)

R_θJA

Thermal resistance

(2)

R_θJM

6.5

Notes

Thermal resistance junction-to-ambient to follow JEDEC^®51-2A, device mounted on FR4 PCB, 2 oz. standard footprint

Thermal resistance junction-to-mount to follow JEDEC^®51-14 using Transient Dual Interface Test Method (TDIM)

(1)

(2)

IMMUNITY TO STATIC ELECTRICAL DISCHARGE TO THE FOLLOWING STANDARDS

(T_A= 25 °C unless otherwise noted)

STANDARD

TEST TYPE

Contact discharge

Air discharge

TEST CONDITIONS

SYMBOL

VALUE

30 kV

IEC 61000-4-2

C = 150 pF, R = 330 Ω

ESD

30 kV

Revision: 10-Nov-2023

Document Number: 98464

For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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