Datasheet > 5962R8776001SRA

5962R8776001SRA

更新时间： 2024-01-31 21:04:27

品牌	Logo	应用领域
其他 - ETC		驱动器逻辑集成电路
页数	文件大小	规格书
27页	126K
描述
Buffer/Driver

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技术参数
数据手册

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5962R8776001SRA 技术参数

生命周期：	Obsolete	零件包装代码：	DFP
包装说明：	SOP,	针数：	20
Reach Compliance Code：	unknown	HTS代码：	8542.39.00.01
风险等级：	5.31	系列：	ACT
JESD-30 代码：	R-GDSO-G20	JESD-609代码：	e0
逻辑集成电路类型：	BUS DRIVER	位数：	4
功能数量：	2	端口数量：	2
端子数量：	20	最高工作温度：	125 °C
最低工作温度：	-55 °C	输出特性：	3-STATE
输出极性：	TRUE	封装主体材料：	CERAMIC, GLASS-SEALED
封装代码：	SOP	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE	传播延迟（tpd）：	10 ns
认证状态：	Not Qualified	筛选级别：	MIL-STD-883
最大供电电压 (Vsup)：	5.5 V	最小供电电压 (Vsup)：	4.5 V
标称供电电压 (Vsup)：	5 V	表面贴装：	YES
技术：	CMOS	温度等级：	MILITARY
端子面层：	TIN LEAD	端子形式：	GULL WING
端子位置：	DUAL	总剂量：	100k Rad(Si) V
Base Number Matches：	1

5962R8776001SRA 数据手册

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in

the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the

solicitation.

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883

Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.

Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DoDISS

cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DoDISS are the issues of the

documents cited in the solicitation.

ELECTRONIC INDUSTRIES ALLIANCE (EIA)

JEDEC Standard No. 17 - A Standardized Test Procedure for the Characterization of the LATCH-UP in CMOS

Integrated Circuits

JEDEC Standard No. 20 - Standardized for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed

CMOS Devices

(Applications for copies should be addressed to the Electronics Industries Alliance, 2001 Eye Street, NW,

Washington DC 20006.)

(Non-Government standards and other publications are normally available from the organizations that prepare or distribute

the documents. These documents may also be available in or through libraries or other informational services.)

2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

SIZE

STANDARD

5962-87760

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

SHEET

DSCC FORM 2234

APR 97

1 2 345 6 7...27

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与5962R8776001SRA相关器件

型号	品牌	描述	获取价格	数据表
5962R8776001SSA	ETC	Buffer/Driver	获取价格
5962R8776001SZA	ETC	Buffer/Driver	获取价格
5962R88534012A	ETC	J-K-Type Flip-Flop	获取价格
5962R8853401EA	ETC	J-K-Type Flip-Flop	获取价格
5962R8853401FA	ETC	J-K-Type Flip-Flop	获取价格
5962R8853401V2A	ETC	J-K-Type Flip-Flop	获取价格

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