ADC128S102QML-SP
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SNAS411P –AUGUST 2008–REVISED APRIL 2017
Changes from Revision H (October 2009) to Revision N
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Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision G (October 2009) to Revision H
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Added reference to Note 11. ................................................................................................................................................. 5
Added Note:11........................................................................................................................................................................ 5
Deleted 'TYPICAL' numbers from tDHID, tDS and tDIH ............................................................................................................... 6
Changed Min limit on tDHID from 11 to 7. ............................................................................................................................... 6
Changes from Revision F (June 2009) to Revision G
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Deleted reference to Ta Min and Ta Max under titled sections. ........................................................................................... 6
Changes from Revision E (April 2009) to Revision F
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Changed AC Electrical Characteristics - SCLK Duty Cycle, typ limits .................................................................................. 8
Changes from Revision C (November 2008) to Revision D
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Moved Rad information from Key Specifications to Features ................................................................................................ 1
Deleted ADC128S102WGMLS reference .............................................................................................................................. 6
Added Burn In Delta Table ..................................................................................................................................................... 9
Changes from Revision B (August 2008) to Revision C
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Corrected package reference from 16-lead TSSOP to 16-lead Ceramic SOIC, Removed QV NSID reference and
Added SMD Number to RQV NSID in Features. ................................................................................................................... 1
Changes from Revision A (August 2008) to Revision B
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Typo, Changed Figure 2, tDIS lower left hand side changed to tDS and tDIH lower left hand side change to tDH in
Timing Diagrams. ................................................................................................................................................................ 10
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