5秒后页面跳转
5962F9568901QEC PDF预览

5962F9568901QEC

更新时间: 2024-01-03 19:51:05
品牌 Logo 应用领域
英特矽尔 - INTERSIL /
页数 文件大小 规格书
4页 76K
描述
Radiation Hardened Quad Differential Line Receiver

5962F9568901QEC 技术参数

生命周期:Active零件包装代码:DFP
包装说明:DFP,针数:16
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.21
输入特性:DIFFERENTIAL SCHMITT TRIGGER接口集成电路类型:LINE RECEIVER
接口标准:GENERAL PURPOSEJESD-30 代码:R-CDFP-F16
功能数量:4端子数量:16
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:DFP
封装形状:RECTANGULAR封装形式:FLATPACK
认证状态:Qualified最大接收延迟:40 ns
接收器位数:4筛选级别:MIL-PRF-38535 Class V
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
温度等级:MILITARY端子形式:FLAT
端子位置:DUAL总剂量:300k Rad(Si) V
Base Number Matches:1

5962F9568901QEC 数据手册

 浏览型号5962F9568901QEC的Datasheet PDF文件第1页浏览型号5962F9568901QEC的Datasheet PDF文件第2页浏览型号5962F9568901QEC的Datasheet PDF文件第4页 
HS-26C32RH  
Die Characteristics  
DIE DIMENSIONS:  
Top Metallization:  
84 mils x 130 mils  
M1: Mo/Tiw  
(2140µm x 3290µm)  
Thickness: 5800Å  
M2: Al/Si/Cu  
Thickness: 5800Å  
INTERFACE MATERIALS:  
Glassivation:  
Worst Case Current Density:  
Type: SiO  
2
5
2
<2.0 x 10 A/cm  
Thickness: 10kÅ ± 1kÅ  
Bond Pad Size:  
110µm x 100µm  
Metallization Mask Layout  
HS-26C32RH  
AIN  
(1)  
V
(16)  
BIN  
(15)  
DD  
(14) B  
IN  
AIN (2)  
(13) B  
OUT  
A
(3)  
OUT  
ENAB (4)  
(12) ENAB  
(11) D  
OUT  
C
(5)  
(6)  
OUT  
(10) D  
IN  
C
IN  
(7)  
(8)  
(9)  
GND  
CIN  
DIN  
3

与5962F9568901QEC相关器件

型号 品牌 描述 获取价格 数据表
5962F9568901QEX RENESAS QUAD LINE RECEIVER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16

获取价格

5962F9568901QXC INTERSIL Radiation Hardened Quad Differential Line Receiver

获取价格

5962F9568901V9A INTERSIL Radiation Hardened Quad Differential Line Receiver

获取价格

5962F9568901VEC INTERSIL Radiation Hardened Quad Differential Line Receiver

获取价格

5962F9568901VEX RENESAS Line Receiver, 4 Func, 4 Rcvr, CMOS, CDIP16

获取价格

5962F9568901VXC INTERSIL Radiation Hardened Quad Differential Line Receiver

获取价格