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5962-9762301QSA PDF预览

5962-9762301QSA

更新时间: 2023-06-19 15:19:33
品牌 Logo 应用领域
德州仪器 - TI 驱动信息通信管理逻辑集成电路总线驱动器总线收发器
页数 文件大小 规格书
21页 887K
描述
具有三态输出的八路总线收发器 | W | 20 | -55 to 125

5962-9762301QSA 技术参数

是否无铅: 不含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:QLCC
包装说明:QCCN, LCC20,.35SQ针数:20
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:6 weeks
风险等级:1.59其他特性:WITH DIRECTION CONTROL
控制类型:COMMON CONTROL计数方向:BIDIRECTIONAL
系列:ABTJESD-30 代码:S-CQCC-N20
长度:8.89 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS TRANSCEIVER最大I(ol):0.064 A
位数:8功能数量:1
端口数量:2端子数量:20
最高工作温度:125 °C最低工作温度:-55 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:QCCN
封装等效代码:LCC20,.35SQ封装形状:SQUARE
封装形式:CHIP CARRIER包装方法:TUBE
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
最大电源电流(ICC):30 mAProp。Delay @ Nom-Sup:3.9 ns
传播延迟(tpd):3.8 ns认证状态:Not Qualified
施密特触发器:No筛选级别:MIL-PRF-38535
座面最大高度:2.03 mm子类别:Bus Driver/Transceivers
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:BICMOS温度等级:MILITARY
端子形式:NO LEAD端子节距:1.27 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
翻译:N/A宽度:8.89 mm

5962-9762301QSA 数据手册

 浏览型号5962-9762301QSA的Datasheet PDF文件第5页浏览型号5962-9762301QSA的Datasheet PDF文件第6页浏览型号5962-9762301QSA的Datasheet PDF文件第7页浏览型号5962-9762301QSA的Datasheet PDF文件第9页浏览型号5962-9762301QSA的Datasheet PDF文件第10页浏览型号5962-9762301QSA的Datasheet PDF文件第11页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Mar-2013  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
SN74ABTH245NE4  
ACTIVE  
PDIP  
N
20  
20  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
-40 to 85  
SN74ABTH245N  
SN74ABTH245PWLE  
SN74ABTH245PWR  
OBSOLETE  
ACTIVE  
TSSOP  
TSSOP  
PW  
PW  
20  
20  
TBD  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
2000  
2000  
2000  
1
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
ABH245  
ABH245  
ABH245  
SN74ABTH245PWRE4  
SN74ABTH245PWRG4  
SNJ54ABTH245FK  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
LCCC  
PW  
PW  
FK  
20  
20  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
POST-PLATE  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
-40 to 85  
-40 to 85  
Green (RoHS  
& no Sb/Br)  
TBD  
-55 to 125 5962-  
9762301Q2A  
SNJ54ABTH  
245FK  
SNJ54ABTH245J  
SNJ54ABTH245W  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
20  
20  
1
1
TBD  
TBD  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125 5962-9762301QR  
A
SNJ54ABTH245J  
W
Call TI  
-55 to 125 5962-9762301QS  
A
SNJ54ABTH245W  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Addendum-Page 2  

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