Datasheet > 5962-9669105HUX

5962-9669105HUX

更新时间： 2023-01-03 09:19:14

品牌	Logo	应用领域
美高森美 - MICROSEMI		静态存储器
页数	文件大小	规格书
10页	208K
描述
Standard SRAM, 128KX8, 55ns, CMOS, CDSO32, CERAMIC, SOJ-32

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5962-9669105HUX 数据手册

WMS128K8-XXX

HI-RELIABILITY PRODUCT

128Kx8 MONOLITHIC SRAM, SMD 5962-96691

FEATURES

■ Access Times 15, 17, 20, 25, 35, 45, 55ns

■ 32 pin, Rectangular Ceramic Leadless Chip Carrier

(Package 601)

■ Revolutionary, Center Power/Ground Pinout

JEDEC Approved

■ MIL-STD-883 Compliant Devices Available

■ Commercial, Industrial and Military Temperature Range

■ 5 Volt Power Supply

• 32 lead Ceramic SOJ (Package 101)

• 36 lead Ceramic SOJ (Package 100)

• 36 lead Ceramic Flat Pack (Package 226)

■ Low Power CMOS

■ Evolutionary, Corner Power/Ground Pinout

■ 2V Data Retention Devices Available

JEDEC Approved

(Low Power Version)

• 32 pin Ceramic DIP (Package 300)

• 32 lead Ceramic SOJ (Package 101)

• 32 lead Ceramic Flat Pack (Package 206)

■ TTL Compatible Inputs and Outputs

REVOLUTIONARY PINOUT

EVOLUTIONARY PINOUT

32 DIP

32 CSOJ (DE)

32 FLAT PACK (FE)

TOP VIEW

36 FLAT PACK

36 CSOJ

32 CSOJ (DR)

TOP VIEW

32 CLCC

TOP VIEW

32 A16

A16

A14

A12

VCC

36 NC

31 A15

30 NC

29 WE

28 A13

27 A8

35 A16

34 A15

33 A14

32 A13

31 OE

30 I/O7

29 I/O6

28 GND

31 A15

30 A14

29 A13

28 OE

27 I/O8

26 I/O7

25 GND

3 2 1 32 31 30

A13

I/O0

I/O1

I/O2

26 A9

25 A11

24 OE

23 A10

22 CS

21 I/O7

20 I/O6

19 I/O5

18 I/O4

17 I/O3

A11

A10

GND

I/O3

I/O4

VCC

GND 10

I/O2 11

I/O3 12

WE 13

A4 14

A5 15

A6 16

A7 17

NC 18

VCC

23 I/O6

22 I/O5

21 A12

20 A11

19 A10

18 A9

26 I/O5

25 I/O4

24 A12

23 A11

22 A10

21 A9

I/O0

I/O7

I/O0

I/O1

I/O2

GND

14 15 16 17 18 19 20

17 A8

20 A8

19 NC

PIN DESCRIPTION

A0-16

I/O0-7

Address Inputs

Data Input/Output

Chip Select

Output Enable

Write Enable

+5.0V Power

Ground

VCC

GND

February 2000 Rev. 3

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

12 3 4 5 6 7...10

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