5962-9089601M2A

更新时间： 2024-01-21 12:10:33

品牌	Logo	应用领域
德州仪器 - TI		运算放大器
页数	文件大小	规格书
46页	994K
描述
EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS

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替代型号

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5962-9089601M2A 数据手册

TLE2027, TLE2037, TLE2027A, TLE2037A, TLE2027Y, TLE2037Y

EXCALIBUR LOW-NOISE HIGH-SPEED

PRECISION OPERATIONAL AMPLIFIERS

ꢀ

SLOS192C − FEBRUARY 1997 − REVISED APRIL 2010

TLE202xY chip information

This chip, when properly assembled, displays characteristics similar to the TLE202xC. Thermal compression

or ultrasonic bonding may be used on the doped-aluminum bonding pads. The chip may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

(1)

(3)

CC+

(6)

OFFSET N1

IN+

(4)

(7)

(6)

(8)

(7)

(6)

OUT

(2)

(8)

IN−

−

(4)

OFFSET N2

CC−

(5)

(3)

(7)

(4)

CHIP THICKNESS: 15 MILS TYPICAL

(2)

BONDING PADS: 4 × 4 MILS MINIMUM

T max = 150°C

TOLERANCES ARE 10%.

(1)

(2)

(3)

ALL DIMENSIONS ARE IN MILS.

(8)

PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

(1)

1 234 5 6 7...46

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5962-9089601M2A 替代型号

型号	品牌	替代类型	描述	数据表
TLE2027MFKB	TI	完全替代	EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS
TLE2027AMFKB	TI	类似代替	EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS
5962-9089603Q2A	TI	功能相似	EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS

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