Datasheet > 5962-8863401YX

5962-8863401YX

更新时间： 2024-02-14 09:47:35

品牌	Logo	应用领域
XICOR		可编程只读存储器电动程控只读存储器电可擦编程只读存储器内存集成电路
页数	文件大小	规格书
21页	196K
描述
EEPROM, 32KX8, 120ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32

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5962-8863401YX 技术参数

生命周期：	Active	包装说明：	LCC-32
Reach Compliance Code：	compliant	风险等级：	5.66
最长访问时间：	120 ns	JESD-30 代码：	R-CQCC-N32
长度：	13.97 mm	内存密度：	262144 bit
内存集成电路类型：	EEPROM	内存宽度：	8
功能数量：	1	端子数量：	32
字数：	32768 words	字数代码：	32000
工作模式：	ASYNCHRONOUS	最高工作温度：	125 °C
最低工作温度：	-55 °C	组织：	32KX8
封装主体材料：	CERAMIC, METAL-SEALED COFIRED	封装代码：	QCCN
封装形状：	RECTANGULAR	封装形式：	CHIP CARRIER
并行/串行：	PARALLEL	编程电压：	5 V
认证状态：	Not Qualified	筛选级别：	MIL-STD-883 Class C
座面最大高度：	2.54 mm	最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	4.5 V	标称供电电压 (Vsup)：	5 V
表面贴装：	YES	技术：	CMOS
温度等级：	MILITARY	端子形式：	NO LEAD
端子节距：	1.27 mm	端子位置：	QUAD
宽度：	11.43 mm	最长写入周期时间 (tWC)：	10 ms
Base Number Matches：	1

5962-8863401YX 数据手册

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883

Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the

Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN

class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing

(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535

may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval

in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make

modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These

modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535

is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535, appendix A and herein.

3.2.1 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.2 Truth table(s). The truth table(s) for unprogrammed devices shall be as specified on figure 3.

3.2.2.1 Programmed devices. The requirements for supplying programmed devices are not part of this drawing.

3.2.3 Case outlines. The case outlines shall be in accordance with figure 1 and 1.2.2 herein.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed

in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN

number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.

3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance

to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in

accordance with MIL-PRF-38535 to identify when the QML flow option is used.

SIZE

STANDARD

5962-88634

MICROCIRCUIT DRAWING

REVISION LEVEL

SHEET

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

1 234 5 6 7...21

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与5962-8863401YX相关器件

型号	品牌	描述	获取价格	数据表
5962-8863401ZA	ATMEL	EEPROM, 32KX8, 120ns, Parallel, CMOS, CDFP28, CERAMIC, FP-28	获取价格
5962-8863401ZX	XICOR	EEPROM, 32KX8, 120ns, Parallel, CMOS, CDFP28, CERAMIC, FP-28	获取价格
5962-8863402UA	ATMEL	EEPROM, 32KX8, 120ns, Parallel, CMOS, CPGA28, PGA-28	获取价格
5962-8863402UC	XICOR	EEPROM, 32KX8, 120ns, Parallel, CMOS, CPGA28	获取价格
5962-8863402UX	ETC	x8 EEPROM	获取价格
5962-8863402XA	ATMEL	EEPROM, 32KX8, 120ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28	获取价格

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