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5962-8757906XC PDF预览

5962-8757906XC

更新时间: 2024-01-09 20:34:12
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
17页 76K
描述
Transceiver

5962-8757906XC 技术参数

生命周期:Active零件包装代码:DFP
包装说明:DFP,针数:36
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.77Is Samacsys:N
JESD-30 代码:R-XDFP-F36功能数量:2
端子数量:36封装主体材料:UNSPECIFIED
封装代码:DFP封装形状:RECTANGULAR
封装形式:FLATPACK认证状态:Qualified
筛选级别:MIL-PRF-38534座面最大高度:4.191 mm
表面贴装:YES电信集成电路类型:MIL-STD-1553 DATA BUS TRANSCEIVER
端子形式:FLAT端子节距:2.54 mm
端子位置:DUALBase Number Matches:1

5962-8757906XC 数据手册

 浏览型号5962-8757906XC的Datasheet PDF文件第1页浏览型号5962-8757906XC的Datasheet PDF文件第2页浏览型号5962-8757906XC的Datasheet PDF文件第3页浏览型号5962-8757906XC的Datasheet PDF文件第5页浏览型号5962-8757906XC的Datasheet PDF文件第6页浏览型号5962-8757906XC的Datasheet PDF文件第7页 
SPECIFICATION  
DEPARTMENT OF DEFENSE  
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.  
STANDARDS  
DEPARTMENT OF DEFENSE  
MIL-STD-883  
-
Test Method Standard Microcircuits.  
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.  
HANDBOOKS  
DEPARTMENT OF DEFENSE  
MIL-HDBK-103 - List of Standard Microcircuit Drawings.  
MIL-HDBK-780 - Standard Microcircuit Drawings.  
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization  
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)  
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text  
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a  
specific exemption has been obtained.  
3. REQUIREMENTS  
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with  
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The  
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for  
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified  
herein.  
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified  
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.  
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.  
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.  
3.2.3 Logic diagrams. The logic diagrams shall be as specified on figure 2.  
3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the  
electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the  
full ambient operating temperature range.  
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical  
tests for each subgroup are defined in table I.  
SIZE  
STANDARD  
5962-87608  
A
MICROCIRCUIT DRAWING  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43216-5000  
REVISION LEVEL  
SHEET  
D
4
DSCC FORM 2234  
APR 97  

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