Datasheet > 5962-8757905XA

5962-8757905XA

更新时间： 2024-02-15 22:41:06

品牌	Logo	应用领域
其他 - ETC		电信集成电路
页数	文件大小	规格书
17页	76K
描述
Transceiver

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数据手册

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5962-8757905XA 技术参数

生命周期：	Obsolete	零件包装代码：	DFP
包装说明：	DFP,	针数：	36
Reach Compliance Code：	unknown	HTS代码：	8542.39.00.01
风险等级：	5.49	Is Samacsys：	N
JESD-30 代码：	R-XDFP-F36	JESD-609代码：	e4
长度：	48.26 mm	功能数量：	2
端子数量：	36	最高工作温度：	125 °C
最低工作温度：	-55 °C	封装主体材料：	UNSPECIFIED
封装代码：	DFP	封装形状：	RECTANGULAR
封装形式：	FLATPACK	认证状态：	Not Qualified
筛选级别：	MIL-PRF-38534	座面最大高度：	4.2 mm
标称供电电压：	15 V	表面贴装：	YES
电信集成电路类型：	MIL-STD-1553 DATA BUS TRANSCEIVER	温度等级：	MILITARY
端子面层：	GOLD	端子形式：	FLAT
端子节距：	2.54 mm	端子位置：	DUAL
宽度：	19.812 mm	Base Number Matches：	1

5962-8757905XA 数据手册

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883

Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Logic diagrams. The logic diagrams shall be as specified on figure 2.

3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the

full ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table I.

SIZE

STANDARD

5962-87608

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

SHEET

DSCC FORM 2234

APR 97

1 2 345 6 7...17

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