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5962-0324601Q9X PDF预览

5962-0324601Q9X

更新时间: 2024-02-10 14:50:39
品牌 Logo 应用领域
ACTEL 时钟外围集成电路
页数 文件大小 规格书
217页 1554K
描述
RISC Microprocessor, 32-Bit, 15MHz, CMOS, DIE

5962-0324601Q9X 技术参数

生命周期:Active包装说明:DIE,
Reach Compliance Code:compliantECCN代码:3A001.A.2.C
HTS代码:8542.31.00.01风险等级:5.71
地址总线宽度:32位大小:32
边界扫描:YES最大时钟频率:30.3 MHz
外部数据总线宽度:32格式:FLOATING POINT
集成缓存:NOJESD-30 代码:X-XUUC-N
低功率模式:YES最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:UNSPECIFIED
封装代码:DIE封装形状:UNSPECIFIED
封装形式:UNCASED CHIP认证状态:Qualified
筛选级别:MIL-PRF-38535 Class Q速度:15 MHz
最大供电电压:3.45 V最小供电电压:3.15 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子形式:NO LEAD端子位置:UPPER
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISCBase Number Matches:1

5962-0324601Q9X 数据手册

 浏览型号5962-0324601Q9X的Datasheet PDF文件第1页浏览型号5962-0324601Q9X的Datasheet PDF文件第3页浏览型号5962-0324601Q9X的Datasheet PDF文件第4页浏览型号5962-0324601Q9X的Datasheet PDF文件第5页浏览型号5962-0324601Q9X的Datasheet PDF文件第6页浏览型号5962-0324601Q9X的Datasheet PDF文件第7页 
MIL-PRF-38535K  
CONTENTS  
PARAGRAPH  
PAGE  
1 SCOPE ......................................................................................................................................................................1  
1.1 Scope......................................................................................................................................................................1  
2. APPLICABLE DOCUMENTS ....................................................................................................................................1  
2.1 General ...................................................................................................................................................................1  
2.2 Government documents..........................................................................................................................................2  
2.2.1 Specifications, standards, and handbooks...........................................................................................................2  
2.2.2 Other Government documents, drawings, and publications.................................................................................2  
2.3 Non-Government publications.................................................................................................................................2  
2.4 Order of precedence ...............................................................................................................................................3  
3. REQUIREMENTS .....................................................................................................................................................3  
3.1 General ...................................................................................................................................................................3  
3.1.1 Reference to applicable device specification........................................................................................................3  
3.2 Item requirements ...................................................................................................................................................3  
3.2.1 Certification of conformance and acquisition traceability......................................................................................4  
3.3 Quality management (QM) program........................................................................................................................5  
3.3.1 Manufacturer's review system..............................................................................................................................5  
3.3.2 QM plan................................................................................................................................................................5  
3.3.3 Self-assessment program ....................................................................................................................................5  
3.3.4 Change control procedures..................................................................................................................................5  
3.3.4.1 Discontinuation of products...............................................................................................................................5  
3.4 Requirements for listing on a QML..........................................................................................................................5  
3.4.1 QML certification requirements ............................................................................................................................6  
3.4.1.1 Process capability demonstration......................................................................................................................6  
3.4.1.1.1 New technology insertion...............................................................................................................................6  
3.4.1.2 Management and technology validation............................................................................................................7  
3.4.1.3 On-site validation ..............................................................................................................................................7  
3.4.1.3.1 Second and third party validations .................................................................................................................7  
3.4.1.3.2 Radiation source of supply (RSS) validations ................................................................................................7  
3.4.1.4 Technology validation .......................................................................................................................................7  
3.4.1.4.1 Package design selection reviews .................................................................................................................8  
3.4.1.5 Manufacturer self-validation ..............................................................................................................................9  
3.4.1.6 Change management system ...........................................................................................................................9  
3.4.1.7 Deficiencies and concerns ................................................................................................................................9  
3.4.1.8 Letter of certification..........................................................................................................................................9  
3.4.2 QML qualification requirements............................................................................................................................9  
3.4.2.1 Qualification extension......................................................................................................................................9  
3.4.3 Qualification to RHA levels.................................................................................................................................10  
3.4.4 QML listing.........................................................................................................................................................10  
3.4.5 Maintenance and retention of QML....................................................................................................................10  
3.4.6 QML line shutdown ............................................................................................................................................10  
3.4.7 Revalidation reviews ..........................................................................................................................................10  
3.4.8 Performance requirements for class T devices ..................................................................................................10  
3.4.8.1 Class T radiation requirements .......................................................................................................................11  
3.5 Device specification ..............................................................................................................................................11  
3.6 Marking of microcircuits ........................................................................................................................................11  
3.6.1 Index point..........................................................................................................................................................11  
3.6.2 Part or identification number (PIN).....................................................................................................................12  
3.6.2.1 RHA designator...............................................................................................................................................13  
3.6.2.2 Drawing designator .........................................................................................................................................13  
3.6.2.2.1 Military designator........................................................................................................................................13  
3.6.2.3 Device class designator ..................................................................................................................................13  
3.6.2.4 Case outline ....................................................................................................................................................13  
3.6.2.5 Lead finish.......................................................................................................................................................13  
3.6.3 Certification mark ...............................................................................................................................................13  
3.6.3.1 QD certification mark.......................................................................................................................................13  
ii  

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